The laser cavity electric connection line with SnAg solder for laser flip chip bonding

Chi, Ting Ta; Li, Zhenyu; Yu, Haitao; Yoo, Jae Ok; Sundaram, Arvind; Feng, Xu; Choong, Chong Ser; Lee, Wen

doi:10.1109/eptc59621.2023.10457696

2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) 2023

DOI: 10.1109/eptc59621.2023.10457696

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The laser cavity electric connection line with SnAg solder for laser flip chip bonding

Ting Ta Chi,

Zhenyu Li,

Haitao Yu

et al.

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The laser cavity electric connection line with SnAg solder for laser flip chip bonding

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References 13 publications

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