The low Dk / Df adhesives for high frequency printed circuit board using the novel solvent soluble polyimide

Tasaki, Takashi; Shiotani, Atsushi; Tsuji, Masayuki; Nakamura, Taiyou; Yamaguchi, Takashi

doi:10.1109/impact.2015.7365182

Cited by 6 publications

(5 citation statements)

References 3 publications

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“…High-frequency microwave communication had been widely and rapidly used in new intelligent technologies such as artificial intelligence, internet of things, quantum computing, and so forth. , However, the mutual interference easily occurred during microwave signal transmission between microstrip conductors in integrated circuits and systems, leading to resistance-capacitance time delay, an increase in crosstalk, and more energy consumption. , To reduce resistance-capacitance time delay and crosstalk interference, low dielectric constant and low dielectric loss polymer composites with controllable dielectric properties had increasingly been studied to satisfy characteristic impedance matching in different transmission conditions. − …”

Section: Introductionmentioning

confidence: 99%

Symmetrical “Sandwich” Polybutadiene Film with High-Frequency Low Dielectric Constants, Ultralow Dielectric Loss, and High Adhesive Strength

Zhang

Zhou

et al. 2019

Ind. Eng. Chem. Res.

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To solve film formation and creep of nonvulcanized polybutadiene liquid rubber, it was designed and fabricated as a thermosetting, transferable, and symmetrical “sandwich” structure adhesive film through solution coating processing. The adhesive failure evolved from an independent cohesive failure or interfacial failure to a randomly staggered interfacial failure. According to the molecular dynamic simulation, compared to the molecular structure of 1,4-polybutadiene, the isolated π electron cloud of the vinyl side chain of 1,2-polybutadiene can form “chemical-like bonding” with the outer electrons of copper atoms. Meanwhile, the peel strength of the surface-modified polybutadiene adhesive (28.16 N/25 mm) was about three times that of the untreated one (10.11 N/25 mm), and its dielectric properties (ε′ = 2.416 and tan δ = 0.0026) maintained an ultralow level at 10 GHz, which was mainly decided by the electronic and atomic polarization of vinyl. This strategy was helpful to develop a processing method for the adhesive film of nonvulcanized liquid rubber and apply to high-speed signal transmission.

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Section: Introductionmentioning

confidence: 99%

Symmetrical “Sandwich” Polybutadiene Film with High-Frequency Low Dielectric Constants, Ultralow Dielectric Loss, and High Adhesive Strength

Zhang

Zhou

et al. 2019

Ind. Eng. Chem. Res.

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“…And with the arrival of 5G communication, high-frequency signal transmission becomes the current development direction of communication technology. However, some defects such as crosstalk interference, resistance-capacitance delay and power dissipation [1] would damage the highfrequency signal complete propagation in composite substratebased printed circuit boards (PCBs). To weaken these defects, composite substrates for PCBs need to have a low dielectric constant (ε r ) and dielectric loss (tanδ).…”

Section: Introductionmentioning

confidence: 99%

Investigation of TiO₂ and SiO₂ Filled Polybutadiene Composite Substrates and Their Dielectric Properties

Liu

Yang

et al. 2023

ChemistrySelect

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Polybutadiene‐based (PB) composite substrates filled with TiO2 and SiO2 ceramics were fabricated in this work. The total content of ceramic components modified by vinyltrimethoxysilane (A171) was fixed at 80 wt.% with TiO2 amount varying from zero to 8 wt.%. The differences of characteristics of ceramic fillers before and after surface modification were analyzed comprehensively and the treated ceramic fillers were uniformly distributed in the polymer matrix. The effects of TiO2 filler addition on the performances of SiO2/PB composite substrates, such as microstructure, moisture absorption, dielectric and thermal properties were also systematically studied. The composite filled with 4 wt.% TiO2 and 76 wt.% SiO2 exhibited excellent dielectric properties with proper dielectric constant (ϵr=3.2), ultra‐low dielectric loss (tanδ=0.0017) at 10 GHz and a near‐zero τϵ (0.5 ppm/°C) was obtained at filler content of 8 wt.% TiO2 and 72 wt.% SiO2.

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“…The main development directions of PCBs in the 5G era are a high layer count design, high frequency, and high levels of signal integrity, as well as high wiring density, which have incurred more stringent demands on the PCB substrate materials, i.e., copper clad laminates (CCL). In addition to lead-free compatibility and reliability requirements, a low dielectric constant (D k ) and extremely low dielectric loss (D f ) under high frequency are the most challenging material properties which have attracted great attention in both industry and academic institutions [1][2][3][4][5].…”

Section: Introductionmentioning

confidence: 99%

Effects of Peroxide Initiator on the Structure and Properties of Ultralow Loss Thermosetting Polyphenylene Oxide-Based Composite

Fang

Liu³

et al. 2022

Polymers

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Although thermosetting polyphenylene oxide- (PPO) based composites with excellent dielectric properties have been widely accepted as superior resin matrices of high-performance copper clad laminate (CCL) for 5G network devices, there has been limited information regarding the composition–process–structure–property relationships of the systems. In this work, the effects of peroxide initiator concentration on the structure and dielectric properties of a free radical cured ultralow loss PPO/Triallyl isocyanate (TAIC) composite system were studied. As expected, the glass transition temperature (Tg) and storage modulus increased with the advancing of crosslinking, whereas the dielectric loss showed an “abnormal” rise with the increase in crosslink density. Extensive studies were carried out by varying the initiator contents and characterizing the structure with spectroscopy, thermal analysis, and positron annihilation lifetime spectrum (PALS) techniques. The results show that the competition of polarity, crosslink density, free volume, and free TAIC are the key factors determining the dielectric properties of the composites.

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The low Dk / Df adhesives for high frequency printed circuit board using the novel solvent soluble polyimide

Cited by 6 publications

References 3 publications

Symmetrical “Sandwich” Polybutadiene Film with High-Frequency Low Dielectric Constants, Ultralow Dielectric Loss, and High Adhesive Strength

Symmetrical “Sandwich” Polybutadiene Film with High-Frequency Low Dielectric Constants, Ultralow Dielectric Loss, and High Adhesive Strength

Investigation of TiO₂ and SiO₂ Filled Polybutadiene Composite Substrates and Their Dielectric Properties

Effects of Peroxide Initiator on the Structure and Properties of Ultralow Loss Thermosetting Polyphenylene Oxide-Based Composite

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The low Dk / Df adhesives for high frequency printed circuit board using the novel solvent soluble polyimide

Cited by 6 publications

References 3 publications

Symmetrical “Sandwich” Polybutadiene Film with High-Frequency Low Dielectric Constants, Ultralow Dielectric Loss, and High Adhesive Strength

Symmetrical “Sandwich” Polybutadiene Film with High-Frequency Low Dielectric Constants, Ultralow Dielectric Loss, and High Adhesive Strength

Investigation of TiO2 and SiO2 Filled Polybutadiene Composite Substrates and Their Dielectric Properties

Effects of Peroxide Initiator on the Structure and Properties of Ultralow Loss Thermosetting Polyphenylene Oxide-Based Composite

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Investigation of TiO₂ and SiO₂ Filled Polybutadiene Composite Substrates and Their Dielectric Properties