The material removal and the nanometric surface characteristics formation mechanism of TiC/Ni cermet in ultra-precision grinding

Zhu, Yueying; Zhang, Quanli; Zhao, Qingliang; To, Suet

doi:10.1016/j.ijrmhm.2021.105494

Cited by 12 publications

(3 citation statements)

References 27 publications

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Section: Introductionmentioning

confidence: 96%

“…Other experimental studies achieved smooth surfaces using cutting depths ranging from 1 to 20 μm. Notably, the pop-in event, which represents the transition from elastic to plastic deformation, occurred at different indentation depths in molecular dynamics simulations (1 nm with a 4 nm radius indenter) 11 and experiments (about 35 nm with a 2.436 μm radius indenter). 12 However, despite the progress in understanding the mechanical properties of KDP crystals, many detailed mechanisms of KDP deformation remain unclear, and the design of manufacturing processes for damage-free KDP components has been challenging.…”

Section: Introductionmentioning

confidence: 97%

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Investigation of elastoplastic deformation in potassium dihydrogen phosphate crystals through nanoindentation and ultra-precision fly cutting experiments

Liu,

Song,

Wang

et al. 2024

Opt. Eng.

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Potassium dihydrogen phosphate (KDP) crystals are widely used in high-power laser systems and inertial confinement fusion applications. However, machining KDP crystals using ultra-precision fly-cutting technology poses challenges due to the combined elastic, plastic, and brittle deformation mechanisms, making it difficult to analyze the material removal process. This investigation aims to observe and analyze the elastoplastic behavior of KDP crystals in the ductile region, which has received limited attention in previous studies. Nanoindentation experiments were conducted to analyze the elasto-plastic transition in KDP crystals, employing an approach instead of the traditional Oliver-Pharr method. Additionally, a cutting experimental method was developed to observe the reverse behavior during manufacturing by introducing a process with a 0 nm depth of cut. The results reveal significant rebound deformation and anelastic behavior, providing a comprehensive understanding of the deformation mechanism in KDP crystals at the nano-and micro-scale cutting levels. This knowledge contributes to modifying the diamond turning process and optimizing the fabrication procedure of KDP crystals.

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Section: Introductionmentioning

confidence: 96%

Section: Introductionmentioning

confidence: 97%

Investigation of elastoplastic deformation in potassium dihydrogen phosphate crystals through nanoindentation and ultra-precision fly cutting experiments

Liu,

Song,

Wang

et al. 2024

Opt. Eng.

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“…The surface of the diamond wheel is covered with irregularly shaped abrasive grains, which can be regarded as multiple blades collectively cutting the material surface, constituting a complex machining process. The removal mechanisms of hard and brittle materials, represented by metal ceramics, generally involve two modes: brittle removal and ductile removal [12,13]. Klocke et al [14] conducted a single grain cutting test on the WC-Co alloy, where scratches indicated a transition from ductile to brittle removal mechanisms, predominantly characterized by brittle removal mechanisms.…”

Section: Introductionmentioning

confidence: 99%

Investigation of the Machined Surface Integrity of WC-High-Entropy Alloy Cemented Carbide

Yin,

Du,

Sun

et al. 2024

Metals

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A fine-grained WC-15wt%Al0.5CoCrFeNi cemented carbide was prepared through a vacuum and gas pressure sintering. For achieving high surface integrity, diamond wheel grinding serves as the primary molding process for the machining of WC cemented carbide. To reveal the influence of grinding on the surface integrity of fine-grained WC-HEA cemented carbide, studies were conducted on grinding force, surface microstructure, surface roughness, residual stress, microhardness, and bending strength. The morphological analysis of the ground surface indicated a transition in the material removal mechanism of WC-HEA cemented carbide from ductile removal to brittle removal, with brittle removal becoming predominant as the depth of grinding increases. With the increasing depth of grinding, the grinding force increases, and the grinding force increases while the surface roughness decreases. Correspondingly, there is an improvement in both hardness and bending strength. Additionally, grinding induces high residual compressive stress on the surface, with a maximum compressive stress of 1795 MPa. The bending strength of the material is found to be dependent on the residual stress.

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A review of simulation and experiment research on cutting mechanism and cutting force in nanocutting process

Chen

et al. 2022

Int J Adv Manuf Technol

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The material removal and the nanometric surface characteristics formation mechanism of TiC/Ni cermet in ultra-precision grinding

Cited by 12 publications

References 27 publications

Investigation of elastoplastic deformation in potassium dihydrogen phosphate crystals through nanoindentation and ultra-precision fly cutting experiments

Investigation of elastoplastic deformation in potassium dihydrogen phosphate crystals through nanoindentation and ultra-precision fly cutting experiments

Investigation of the Machined Surface Integrity of WC-High-Entropy Alloy Cemented Carbide

A review of simulation and experiment research on cutting mechanism and cutting force in nanocutting process

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