The mechanical effect of soft pad on copper chemical mechanical polishing

Liu, Pengzhan; Nam, Yuna; Lee, Seung Hwan; Kim, Eungchul; Jeon, Sanghuck; Park, Kihong; Hong, Seok‐Jun; Kim, Taesung

doi:10.1016/j.mssp.2022.107256

Cited by 6 publications

(3 citation statements)

References 36 publications

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“…The polishing time required to remove a certain thickness of film is influenced by the pad surface and stiffness. 6 Therefore, consistent pad asperity and depth are crucial for stable CMP performance. However, during CMP process, the asperities are often deformed, and the depth of the pad groove gradually decreases.…”

Section: Resultsmentioning

confidence: 99%

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Development of Novel Conditioning Method Using Thermal Shape Memory Characteristics of Polyurethane CMP Pad

Seo,

Jeon,

Yoon

et al. 2024

ECS J. Solid State Sci. Technol.

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Traditionally, the pad roughness has been maintained by wearing down the polyurethane pad with diamond disk. However, that method generates debris and reduces pad lifetime. This study propose a new approach to pad surface recovery by synthesizing a polyurethane-based raw material that exhibits shape memory behavior and can recover its shape upon heating. The findings suggest that the pad's surface can be maintained by utilizing its shape memory trait and designing a system to heat the pad. The pad recovery tests were conducted using universal test machine (UTM) samples and found that, in terms of heat recovery, increasing the temperature had a greater effect than increasing the exposure time. Chemical mechanical planarization (CMP) testing was performed by using three conditioning potions: diamond disk conditioning, heat conditioning, and no conditioning. The results showed that pad asperity was recovered more efficiently with heat conditioning than with no conditioning (demonstrated by a 19% higher removal rate). The experimental results can be expected that combines diamond disk conditioning with heat conditioning could be a superior alternative for pad surface refreshment. Shape memory pads can return to their original form, leading to better CMP performance and an extended pad lifetime.

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Section: Resultsmentioning

confidence: 99%

“…The metal CMP slurry must be treated with hydrogen peroxide before the CMP process is carried out. [4][5][6] As known well, the CMP process is conducted in wet condition over many hours. For this reason, the properties of the pad, which are composed of polymer, can be altered.…”

mentioning

confidence: 99%

Development of Novel Conditioning Method Using Thermal Shape Memory Characteristics of Polyurethane CMP Pad

Seo,

Jeon,

Yoon

et al. 2024

ECS J. Solid State Sci. Technol.

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“…To uphold the CoCrMo alloy surface quality in this CMP process, BTA is added, proving critical for enhancing the longevity of artificial knee joints. The BTA functions as an effective corrosion inhibitor, hindering undesirable surface reactions [ 29 , 30 ]. When the alloy is immersed in a BTA-containing solution, a passive layer is formed, comprising a complex between the alloy and the benzotriazole.…”

Section: Resultsmentioning

confidence: 99%

Nanoscale Surface Refinement of CoCrMo Alloy for Artificial Knee Joints via Chemical Mechanical Polishing

Zhang,

Lai

et al. 2023

Materials

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In this study, we address the challenge of surface roughness in CoCrMo alloys, typically used in artificial knee joints, which can initiate a cascade of biological responses causing inflammation, osteolysis, joint instability, and increased susceptibility to infection. We propose the application of a chemical mechanical polishing (CMP) technique, using an ecologically responsible slurry composed of 4 wt% SiO2, 0.3 wt% H2O2, 1.0 wt% glycine, and 0.05 wt% benzotriazole. Our innovative approach demonstrated significant improvements, achieving a material removal rate of 30.9 nm/min and reducing the arithmetic mean roughness from 20.76 nm to 0.25 nm, thereby enhancing the nanoscale surface quality of the artificial knee joint alloy. The smoother surface is attributed to a decrease in corrosion potential to 0.18 V and a reduction in corrosion current density from 9.55 µA/cm2 to 4.49 µA/cm2 with the addition of BTA, evidenced by electrochemical tests. Furthermore, the preservation of the phase structure of the CoCrMo alloy, as confirmed by XRD analysis and elemental mapping, ensures the structural integrity of the treated surfaces. These outcomes and our simulation results demonstrate the effectiveness of our CMP method in engineering surface treatments for artificial knee joints to optimize friction behavior and potentially extend their lifespans.

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Angstrom surface on copper induced by novel green chemical mechanical polishing using ceria and silica composite abrasives

Liu,

Zhang,

Zhou

et al. 2023

Applied Surface Science

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The mechanical effect of soft pad on copper chemical mechanical polishing

Cited by 6 publications

References 36 publications

Development of Novel Conditioning Method Using Thermal Shape Memory Characteristics of Polyurethane CMP Pad

Development of Novel Conditioning Method Using Thermal Shape Memory Characteristics of Polyurethane CMP Pad

Nanoscale Surface Refinement of CoCrMo Alloy for Artificial Knee Joints via Chemical Mechanical Polishing

Angstrom surface on copper induced by novel green chemical mechanical polishing using ceria and silica composite abrasives

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