The mechanical properties of insert-molded bimaterial composites: Series and parallel geometries

Extrand, C. W.; Bhatt, S.

doi:10.1002/(sici)1097-4628(20000620)76:12<1777::aid-app7>3.0.co;2-9

Cited by 5 publications

(2 citation statements)

References 6 publications

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“…The PC/C fiber PEEK composite failed at slightly smaller strains than the monolithic C fiber PEEK. Its modulus was intermediate to the moduli of the individual components 4…”

Section: Resultsmentioning

confidence: 98%

“…Recently, insert‐molding has been used in the construction of polycarbonate (PC)/C fiber polyetheretherketone (PEEK) containers for the transportation and storage of silicon wafers 3. Earlier work on these bimaterial composites examined the mechanical performance4 and fracture properties 5. Although the strength of the bimaterial composite and its thermophysical bond were deemed adequate for the intended application, there were concerns that exposure to cleaning chemicals may weaken or destroy the bond.…”

Section: Introductionmentioning

confidence: 99%

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The chemical compatibility of insert-molded bimaterial composites of polycarbonate and carbon fiber polyetheretherketone

Extrand

Bhatt

2000

J. Appl. Polym. Sci.

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Chemical compatibility of a bimaterial composite composed of polycarbonate (PC) and C fiber polyetheretherketone (PEEK) was examined. Series composite specimens were constructed by injecting C fiber PEEK into a mold containing one half of a PC dogbone. Specimens were exposed for 2 weeks at room temperature to various cleaning chemicals that are commonly used in semiconductor fabrication facilities: deionized water, 0.1% aqueous Triton CL10 surfactant, 0.1% aqueous Alfonic 610‐3.5 surfactant, and isopropyl alcohol. To increase the severity of the test, some samples were strained and/or notched before immersion. After exposure, specimens were tested in tension and results were compared to their corresponding pre‐exposure values. None of the chemicals affected the strength of the unstrained, unnotched PC/C fiber PEEK composite. However, isopropyl alcohol and the surfactant solutions caused the strained specimens to fail (both unnotched and notched) during chemical exposure. The strains used during exposure were near the respective breaking points of the unnotched and notched composite. Consequently, only a slight reduction in strength from chemical exposure was needed to cause failure. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 78: 173–178, 2000

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“…The PC/C fiber PEEK composite failed at slightly smaller strains than the monolithic C fiber PEEK. Its modulus was intermediate to the moduli of the individual components 4…”

Section: Resultsmentioning

confidence: 98%

Section: Introductionmentioning

confidence: 99%

The chemical compatibility of insert-molded bimaterial composites of polycarbonate and carbon fiber polyetheretherketone

Extrand

Bhatt

2000

J. Appl. Polym. Sci.

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Insert‐molded poly(ether imide)/carbon fiber poly(ether ether ketone) bimaterial composites: Fracture and interfacial analysis

Moon

Monson

Extrand

2006

J of Applied Polymer Sci

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Bimaterial composites were constructed by injecting carbon-fiber-filled poly(etheretherketone) (CF PEEK) into a mold containing one-half of a poly(etherimide) (PEI) tensile specimen. Specimens were notched at the interface and tested in tension. Using fracture mechanics, the adhesion strength of the interface (a fracture energy with units of energy per area) was calculated from notch size and stressstrain behavior of the notched specimens. Fracture energies (with units of energy per area) of the PEI/CF PEEK bimaterial composites were slightly less than those measured from the monolithic materials of construction. Variations in test speed (below the glass transition temperature of the two components) had little effect on stiffness or fracture energy. However, fracture energies decreased slightly as temperature increased. Composites fractured through the CF PEEK near the PEI/CF PEEK interface. Consequently, the fracture surface of the PEI portion had a thin layer of CF PEEK (a qualitative indicator of good adhesion). Microscopy and X-ray photoelectron spectroscopy confirmed the presence of a thin layer of CF PEEK on the PEI. It appears that the miscibility of PEI and PEEK contributed to the strength of the PEI/CF PEEK thermophysical bond. The strength of the thermophysical bond of the PEI/CF PEEK bimaterial composites was greater than the cohesive strength of amorphous commodity polymers such as polystyrene and should be more than adequate for most microelectronics device handling applications.

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