The mechanism of copper powder formation in potentiostatic deposition

Popov, Konstantin; Maksimović, M.D.; Lukic, Dragoljub; Pavlović, Marko

doi:10.1007/bf00617204

Cited by 28 publications

(10 citation statements)

References 12 publications

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“…4 and 5a and b). Formation of degenerate dendrites and dendrites was accompanied by the step-shaped dependences of the average electrodeposition currents on the time, what can be explained by a kind of Faradic cage which is formed by branching dendrites and which prevent further deposition on the initial cathode surface and previously formed dendrites [26]. Finally, copper deposits belonging to the third group were of the typical honeycomb-like structures.…”

Section: -5mentioning

confidence: 98%

Influence of potential pulse conditions on the formation of honeycomb-like copper electrodes

Nikolić

Branković²,

Maksimović

et al. 2009

Journal of Electroanalytical Chemistry

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Section: -5mentioning

confidence: 98%

Influence of potential pulse conditions on the formation of honeycomb-like copper electrodes

Nikolić

Branković²,

Maksimović

et al. 2009

Journal of Electroanalytical Chemistry

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“…Electrodeposition.--A number of investigators have studied the electrodeposition of silver (113,114,115) and copper (116,117,118,119,120,121,122,123,124,125,126,127,128) using cyclic voltammetry, and potentiostatic, galvanostatic, or ac impedance techniques at stationary and rotating electrodes. Rotating electrodes are useful for studying diffusion-controlled deposition processes.…”

Section: Mechanistic Studiesmentioning

confidence: 99%

A Review of Corrosion Failure Mechanisms during Accelerated Tests: Electrolytic Metal Migration

Steppan

Roth

Hall

et al. 1987

J. Electrochem. Soc.

108

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This paper presents an extensive literature review and assessment of corrosion failure mechanisms encountered during accelerated tests of microelectronic devices. The failure mechanism of primary emphasis is electrolytic metal migration. The metallurgies of interest are silver, gold, copper, and aluminum. Electrochemical investigations of dendritic growth are also reviewed. Mechanistic results from the electrochemical investigations are discussed in light of the empirical results of accelerated tests.

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“…It is well known [74,75] that the surface coarseness during potentiostatic electrodeposition in the mixed activation-diffusion control increases with the increase of the current density of electrodeposition. The surface coarseness also increases during potentiostatic electrodeposition at the limiting diffusion current density with an increase of overpotential [18,76], resulting in the formation of dendrites. In metal electrodeposition in the limiting diffusion current density range, the real current density remains constant regardless of the overpotential used.…”

Section: Correlation Between Specific Surface and Overpotential Of Electrodepositionmentioning

confidence: 99%

Electrodeposition of Copper Powders and Their Properties

Nikolić

Popov

2012

Modern Aspects of Electrochemistry

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A powder is a finely divided solid, smaller than 1,000 µm in its maximum dimension. A particle is defined as the smallest unit of a powder. The particles of a powder may assume various forms and sizes, whereas powders, an association of such particles, exhibit, more or less, the same characteristics as if they were formed under identical conditions and if the manipulation of the deposits after removal from the electrode was the same [1,2]. The size of particles of many metal powders can vary in a quite wide range from a few nanometers to several hundreds of micrometers. The most important properties of a metal powder are the specific surface, the apparent density, the flowability, and the particle grain size and distribution. These properties, called decisive properties, characterize the behavior of a metal powder.

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The mechanism of copper powder formation in potentiostatic deposition

Cited by 28 publications

References 12 publications

Influence of potential pulse conditions on the formation of honeycomb-like copper electrodes

Influence of potential pulse conditions on the formation of honeycomb-like copper electrodes

A Review of Corrosion Failure Mechanisms during Accelerated Tests: Electrolytic Metal Migration

Electrodeposition of Copper Powders and Their Properties

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