The Membrane Thickness Prediction of Solder Paste Process by Phase-Shifting Projection

Abstract

Electronic products have become lighter and thinner nowadays. SMT includes three basic steps, namely solder paste print, electronic component adhesion and reflow[1]. This research tends to capture the image of fringe projection based on CCD with optical grating and reconstruct the 3D surface image of solder paste use triangulation measurement. The main ideal is using fringe projection method to observe the distortion of the fringe phenomenon caused by different heights of the surface. Last, the depth of the surface is computed under test variation and the 3D image is reconstructed.