The Microstructure, Thermal, and Mechanical Properties of Sn-3.0Ag-0.5Cu-xSb High-Temperature Lead-Free Solder

Li, Chaojun; Yan, Yanfu; Gao, Tingting; Xu, Genqi

doi:10.3390/ma13194443

Cited by 20 publications

(10 citation statements)

References 33 publications

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“…It is obvious that additions of Ni and GOns have a slight effect on the melting property of SSC-507 solder during the heating process. These results are consistent with previous reports on SSC [25] and SAC composite solders [38,39]. The little raising in melting points of both SSC-Ni and SSC-Ni-GOns solders may be due to (i) Ni element has high melting temperature and dissolves with low solubility in SSC solder [27], (ii) GOns act as nucleation sites for IMCs' solidification process [40], and (iii) Changes in the grain boundary's physical characteristics and interfacial surface stability.…”

Section: Thermal Analysissupporting

confidence: 94%

Synergetic role of Ni and GOns to improve the microstructure and mechanical creep rate of Sn-5.0Sb-0.7Cu solder alloy

Mousa¹,

Mahmoud²,

El-Zhery³

et al. 2023

Phys. Scr.

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The role of minor additions of Ni and GOns to Sn- 5 wt.% Sb- 0.7 wt.% Cu (SSC-507) has been explored. Findings of scanning electron microscopy (SEM), energy dispersive X-ray spectrometry (EDX), and X-ray diffractometry (XRD) display the new phases like (Cu,Ni)6Sn5 and the size decrement of β-Sn grains. A slight increase in the melting temperature was observed using differential scanning calorimetry (DSC) analysis due to adding Ni (ΔTm =1.02 oC) and GOns (ΔTm =0.75 oC). Interestingly, 0.1 wt% Ni addition reduced the under-cooling by ~28 %, whenever adding of 0.1 wt% GOns enhanced the under-cooling by ~115 %. The average size of β-Sn grains of SSC-507 plain solder was decreased from ~150 to ~ 70 μm due to adding of Ni and then GOns. The enhanced creep resistance of SSC-Ni-GOns alloy motivated the values of creep fracture and enhanced the stress exponent parameters (n) by ~ 27%. The outcomes of tensile creep examination demonstrate that increasing levels of stress and testing temperatures raise the steady-state creep rates for all tested alloys. The average activation energy (E) for the three solders ranged from ~ 46.5 kJ/mol to ~ 54.3 kJ/mol which close to that of pipe-diffusion mechanism in Sn based solder alloy.

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Section: Thermal Analysissupporting

confidence: 94%

Synergetic role of Ni and GOns to improve the microstructure and mechanical creep rate of Sn-5.0Sb-0.7Cu solder alloy

Mousa¹,

Mahmoud²,

El-Zhery³

et al. 2023

Phys. Scr.

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“…This should be attributed to the microstructure variation caused by the alloying effect of different elements. In previous studies, the addition of Bi and Sb can generally suppress the coarsening of the β-Sn and IMCs and refine them [ 19 , 23 ]. Therefore, it is reasonable that the Bi, and Sb both significantly improve the strength of the solder alloy.…”

Section: Resultsmentioning

confidence: 99%

“…Antimony (Sb) has been proved to be an effective alloying element that can enhance the mechanical properties of solder alloys [ 17 , 18 ]. Adding Sb could inhibit the formation of coarse β-Sn and also refine the precipitation of Ag 3 Sn, thus improving the mechanical and thermal resistant behavior of SAC solders [ 18 , 19 ]. Bismuth (Bi) is another important alloying element for solder alloy that shows a significant effect in improving the creep resistance and thermal fatigue resistance [ 13 , 20 , 21 , 22 ].…”

Section: Introductionmentioning

confidence: 99%

Effect of Bi, Sb, and Ti on Microstructure and Mechanical Properties of SAC105 Alloys

et al. 2022

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The Sn-Ag-Cu (SAC) solder alloys with a low Ag (Ag < 3 wt.%) content have attracted great attention owing to their low cost, increased ability in bulk compliance, and plastic energy dissipation. However, some of their mechanical properties are generally lower than the SAC alloys with a higher Ag content. Adding alloying elements is an effective approach for improving the mechanical properties of the SAC alloys. In this study, the effect of Bi, Sb, and Ti on Sn-1 wt.%Ag-0.5 wt.%Cu (SAC105) solder alloys was investigated. The SAC solders with four compositions: SAC105-1 wt.%Bi, SAC105-1 wt.%Sb, SAC105-1 wt.%Bi-1 wt.%Sb, SAC105-1 wt.%Bi-1 wt.%Sb-0.4 wt.%Ti were prepared. The microstructure and phase compositions were characterized using electron scanning microscopy, and X-ray diffraction. The thermal properties and wettability were also examined. Uniaxial tensile tests and nano-indentation tests were conducted to evaluate the mechanical properties. The results show that adding Bi or Sb could increase the strength of SAC105 alloys mainly due to the solid solution strengthening effect. The creep resistance of SAC105 alloys was also improved with the additions of Bi and Sb. The co-additions of Bi and Sb into SAC105 alloys exhibit an enhanced creep resistance than that calculated by the theoretical calculation. The further addition of Ti into SAC105-1Bi-1Sb alloys demonstrated a much-improved creep resistance, which could be attributed to the synergistic effects of both solid solution strengthening and the precipitation hardening effects.

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“…The UTS increases with Bi but decreases a bit with Sb (Figure 7c). These improved UTS are attributed to the synergy of Bi and Sb where Sb forms a solid solution with Sn while Bi acts as a dispersing phase in the SAC105 solder alloy, reducing Ag3Sn IMCs [22,23]. In the samples containing Sb and Bi together, the tensile stress tends to increase more significantly compared to when Bi is added alone.…”

Section: Tensile Testmentioning

confidence: 99%

Taguchi Optimization of Wetting, Thermal and Mechanical Properties of Sn-1.0wt.%Ag-0.5wt.%Cu Alloys Modified with Bi and Sb

Hong,

Sharma,

Jung

2024

Materials

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This study was conducted on SAC105 (Sn-1wt.%Ag-0.5wt.%Cu) lead-free solder modified with Bi and Sb. The wetting, melting point, and mechanical properties were analysed with the addition of 1~5 wt.%Bi and 1~5 wt.%Sb for SAC105 base alloy. The wetting characteristics were assessed by wetting time (zero cross time, ZCT) obtained from wetting balance tests. The mechanical properties were analysed by tensile tests. Considering two factors (Bi, Sb), a three-level (0, 1, 2 wt.%) design of experiment (DOE) method array was applied for Taguchi optimization. The results indicated that the solder wetting increased as Bi content increased, while it decreased with Sb. The ZCT decreased with increasing Bi content up to 4 wt.%, while it increased proportionally to Sb content. The melting point, measured using a differential scanning calorimeter (DSC), showed that the melting point tended to decrease according to Bi increase, while it increases depending on the Sb content. Increase in Bi and Sb levels resulted in enhanced tensile strength in the mechanical properties tests, with Bi having a more noticeable impact. The Taguchi optimized conditions for the Bi and Sb studies were found to be 2 wt.%Bi and 2 wt.%Sb. This led to an optimal set of 0.9 s of wetting time, a 222.55 °C melting point, a 55 MPa tensile strength, and a 50% elongation.

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The Microstructure, Thermal, and Mechanical Properties of Sn-3.0Ag-0.5Cu-xSb High-Temperature Lead-Free Solder

Cited by 20 publications

References 33 publications

Synergetic role of Ni and GOns to improve the microstructure and mechanical creep rate of Sn-5.0Sb-0.7Cu solder alloy

Synergetic role of Ni and GOns to improve the microstructure and mechanical creep rate of Sn-5.0Sb-0.7Cu solder alloy

Effect of Bi, Sb, and Ti on Microstructure and Mechanical Properties of SAC105 Alloys

Taguchi Optimization of Wetting, Thermal and Mechanical Properties of Sn-1.0wt.%Ag-0.5wt.%Cu Alloys Modified with Bi and Sb

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