The nanoindentation responses of nickel surfaces with different crystal orientations

Ju, Shin‐Pon; Wang, C.-T.; Chien, Chi‐Hui; Huang, J.C.; Jian, Sheng-Rui

doi:10.1080/08927020701392954

Cited by 52 publications

(22 citation statements)

References 75 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…To validate the results, the alteration in the required load observed in different crystallographic orientations of single crystals is compared with previous studies. The results show good coincidence with the simulations of Ju et al [18] who investigated the nano-indentation process on single-crystal nickel with three different crystallographic orientations. As illustrated in Fig.…”

Section: Atomistic Simulationsupporting

confidence: 87%

The roles of crystallographic orientation, high-angle grain boundary, and indenter diameter during nano-indentation

et al. 2015

View full text Add to dashboard Cite

Molecular dynamics simulation of nano-indentation of single-crystal and bicrystal FCC aluminum is performed. The role of crystallographic orientation during nano-indentation of single-crystal aluminum is assessed. Then, the influence of the presence of a grain boundary is analyzed by adding high-angle symmetric tilt boundaries of 5<210>/(100) and 5<310>/(100) parallel to the surface on which the indentation is performed. Furthermore, in both cases, the size of the indenter is changed to investigate how the surface curvature of the indenter affects the nano-indentation process. The results suggest that in each crystallographic orientation, the presence of a grain boundary increases the required force for indentation, while the distance of a grain boundary from the indentation surface could affect the increase in the required force. Simulations prove that the grain boundary acts as a source of generation and emission of dislocations and restricts the penetration of the indenter by limiting the slip band formation and plastic deformation. The dislocation emission from the grain boundary restricts the penetration of the indenter and limits the formation of the octahedral slip systems of type {111}<110> and consequently increases the required force for indentation in bicrystals.

show abstract

Section: Atomistic Simulationsupporting

confidence: 87%

The roles of crystallographic orientation, high-angle grain boundary, and indenter diameter during nano-indentation

et al. 2015

View full text Add to dashboard Cite

show abstract

“…Thin films of Ni and Ni alloy have been widely used in micro-electro-mechanical systems (MEMS) [13,14] and magnetic storage systems [15,16]. Moreover, defects such as voids significantly affect the performance of materials [11].…”

Section: Introductionmentioning

confidence: 99%

Atomistic simulations of the effect of a void on nanoindentation response of nickel

Zhu

Wang

2010

Sci. China Phys. Mech. Astron.

View full text Add to dashboard Cite

Three-dimensional molecular dynamics simulations have been performed to investigate the effect of a void on the nanoindentation of nickel thin film. The radius and depth of the void are varied to explore how they influence the nanoindentation. The simulation results reveal that the presence of a void softens the material and allows for a larger indentation depth at a given load compared to the no void case. The radius and depth of the void have a major effect on the indentation behaviors of the thin film. It is also observed that the void will collapse during the nanoindentation of crystal with void. And when the indentation depth is sufficiently large, the void will disappear. It is found that the indentation depth needed to make the void disappear depends on the void size and location. nanoindentation, molecular dynamics simulations, void PACS: 46.55.+d, 46.50.+a, 02.70.-c, 31.15.-p

show abstract

“…The nanoscale anisotropic elastic-plastic behavior of single crystal aragonite using nanoindentation with a Berkovich probe and scanning force microscope imaging was studied by Kearney et al [13] Ju et al used molecular dynamic (MD) simulations to elucidate the anisotropic characteristics (pile-up patterns and atomic stress distribution) in the material responses for nickel substrates with different surface orientations. [14] Yoshida et al [15] performed nanoindentation tests with a Berkovich probe on aluminum single crystals in order to investigate the effect of crystallographic planes on the yield load and the hardness of the metals in nearly perfect crystals. Britton et al combined nanoindentation (Berkovich probe), electron backscatter diffraction (EBSD), and CPFEM simulation to examine the anisotropy in the indentation behavior of individual grains within alpha Ti-polycrystals.…”

Section: Nanoindentation Is a Technique Which Hasmentioning

confidence: 99%

Depth Dependence of Nanoindentation Pile-Up Patterns in Copper Single Crystals

Kucharski

Jarząbek

2014

Metall Mater Trans A

View full text Add to dashboard Cite

A study of the dependence of nanoindentation pile-up patterns on the indentation load and crystallographic orientation is presented. Three different orientations-(001), (011), and (111)-of single crystal copper were investigated. Experiments were conducted on a CSM ultrananoindentation tester using a Berkovich tip. The topographic images were obtained using an atomic force microscope. The evolution of pile-up patterns with different applied loads was observed. The results show that for applied loads equal to 0.45 mN and smaller the pile-up patterns do not depend on the crystallographic orientation of the indented surface; instead, they depend on the tip's geometry. On the other hand, in the case of indentation loads bigger than 2 mN, pile-up patterns on the surfaces of (001)-, (011)-, and (111)-oriented single crystals have fourfold, twofold, and sixfold (or threefold) symmetry, respectively. An intermediate state was also reported. Furthermore, a detailed analysis of residual impressions with maximal applied loads equal to 2 mN and bigger reveals that both pile-up and sink-in patterns are present.

show abstract

The nanoindentation responses of nickel surfaces with different crystal orientations

Cited by 52 publications

References 75 publications

The roles of crystallographic orientation, high-angle grain boundary, and indenter diameter during nano-indentation

The roles of crystallographic orientation, high-angle grain boundary, and indenter diameter during nano-indentation

Atomistic simulations of the effect of a void on nanoindentation response of nickel

Depth Dependence of Nanoindentation Pile-Up Patterns in Copper Single Crystals

Contact Info

Product

Resources

About