2022
DOI: 10.1016/j.polymer.2022.124861
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The nature of the gamma dielectric relaxation in diglycidyl ether Bisphenol-A (DGEBA) based epoxies

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Cited by 8 publications
(7 citation statements)
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References 37 publications
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“…In summary, the above results suggest that, over the temperature range considered, the behaviour of the system is moving away from activated tunnelling towards an Arrhenius behaviour. Similar behaviour was reported in [27], particularly in systems that contained moieties that enhanced molecular mobility. We, therefore, concur with the above suggestion that, in the context of Figure 4, "pure thermal activation, as described by the Arrhenius equation is [ .…”
Section: Arrhenius Activated Tunnellingsupporting
confidence: 78%
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“…In summary, the above results suggest that, over the temperature range considered, the behaviour of the system is moving away from activated tunnelling towards an Arrhenius behaviour. Similar behaviour was reported in [27], particularly in systems that contained moieties that enhanced molecular mobility. We, therefore, concur with the above suggestion that, in the context of Figure 4, "pure thermal activation, as described by the Arrhenius equation is [ .…”
Section: Arrhenius Activated Tunnellingsupporting
confidence: 78%
“…This showed that the data aligned well with both Arrhenius and activated tunnelling behaviour, with both methodologies giving physically reasonable parameter values. The significance of this analysis is that it further reinforces the assertion of [27] that "pure thermal activation, as described by the Arrhenius equation, is just a manifestation of activated tunnelling above some material dependent temperature".…”
Section: Discussionsupporting
confidence: 63%
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“…On the one hand, they reduce the mobility of the main-chain moieties and branch/chain ends of the base polymer, which ultimately leads to a lower value of the dielectric constant. On the other hand, they cause the accumulation of additional charges due to the interphase effect of the filler particles dispersed in the volume of the resin [71,[94][95][96][97]. For low filling levels (low wt%) the first effect dominates, so the ability of the composite structure to accumulate charges decreases and the dielectric constant is lowered [95][96][97][98].…”
Section: Analysis and Discussion Of Resultsmentioning
confidence: 99%
“…The curing agent used for the resin is an aliphatic amine-based hardener with a weight ratio of 5:1 (resin to hardener). Epoxy resins of this type are commonly applied in the electrical industry, and their properties are well established [67][68][69][70][71][72][73]. The gelation time of the applied resin at 25 • C is approximately 35 min (2100 s).…”
Section: Experiments Description 21 Materials For Tested Samplesmentioning
confidence: 99%