The newly developed Sn–Bi–Zn alloy with a low melting point, improved ductility, and high ultimate tensile strength

Zhou, Shiqi; Yang, Chih han; Shen, Yu-An; Lin, Shih‐kang; Nishikawa, Hiroshi

doi:10.1016/j.mtla.2019.100300

Cited by 41 publications

(12 citation statements)

References 21 publications

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“…Increasing the strain rate of the tensile test on Sn-58Bi solder was shown by Chen et al (2016) to result in an enhancement of the ultimate tensile strength of the solder from 65 to 110 MPa. Compared to all recorded ultimate tensile strengths for the Sn-58Bi solder alloy, the highest and lowest ultimate tensile strengths recorded were under 5 × 10 −2 s −1 strain rate with 110 MPa (Chen et al , 2016) and under 5 × 10 −4 s −1 strain rates with 48 MPa (Zhou et al , 2019b), respectively.…”

Section: Tensile Propertiesmentioning

confidence: 81%

“…In conclusion, observations on the tensile test fracture surfaces are helpful for fully understanding the solder's tensile properties. Through these observations, the stress-strain curves (Mokhtari and Nishikawa, 2016) Figure 8 Side-views of secondary electron imaging (SEI) fractured images under low-magnification of (a) Sn-58Bi (b) Sn-45Bi-2.6Zn solders; top-view of backscattered electron images under high-magnification of (b) Sn-58Bi (e) Sn-45Bi-2.6Zn solders and sideview of SEI images under highmagnification of (c) Sn-58Bi (f) Sn-45Bi-2.6Zn solders (Zhou et al, 2019b) can be further discussed. The presence of cleavage and bulge in the fractured surfaces can determine the fracture mode of the solder, which also provides information on solder ductility and toughness.…”

Section: Sn-bi-crmentioning

confidence: 99%

“…Zhou et al (2019b) examined the fracture surface of tensile tests conducted on Sn-58Bi and Sn-45Bi-2.6Zn solders. Compared to Figure 8(a), Figure 8(d) clearly shows necking before fracture.…”

Section: Deformation and Fracture Modementioning

confidence: 99%

“…Side-views of secondary electron imaging (SEI) fractured images under low-magnification of (a) Sn-58Bi (b) Sn-45Bi-2.6Zn solders; top-view of backscattered electron images under high-magnification of (b) Sn-58Bi (e) Sn-45Bi-2.6Zn solders and sideview of SEI images under high-magnification of (c) Sn-58Bi (f) Sn-45Bi-2.6Zn solders (Zhou et al , 2019b)…”

Section: Figurementioning

confidence: 99%

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Effects of alloying element on mechanical properties of Sn-Bi solder alloys: a review

Kamaruzzaman

Goh

2022

SSMT

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Purpose This paper aims to review recent reports on mechanical properties of Sn-Bi and Sn-Bi-X solders (where X is an additional alloying element), in terms of the tensile properties, hardness and shear strength. Then, the effects of alloying in Sn-Bi solder are compared in terms of the discussed mechanical properties. The fracture morphologies of tensile shear tested solders are also reviewed to correlate the microstructural changes with mechanical properties of Sn-Bi-X solder alloys. Design/methodology/approach A brief introduction on Sn-Bi solder and reasons to enhance the mechanical properties of Sn-Bi solder. The latest reports on Sn-Bi and Sn-Bi-X solders are combined in the form of tables and figures for each section. The presented data are discussed by comparing the testing method, technical setup, specimen dimension and alloying element weight percentage, which affect the mechanical properties of Sn-Bi solder. Findings The addition of alloying elements could enhance the tensile properties, hardness and/or shear strength of Sn-Bi solder for low-temperature solder application. Different weight percentage alloying elements affect differently on Sn-Bi solder mechanical properties. Originality/value This paper provides a compilation of latest report on tensile properties, hardness, shear strength and deformation of Sn-Bi and Sn-Bi-X solders and the latest trends and in-depth understanding of the effect of alloying elements in Sn-Bi solder mechanical properties.

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Section: Tensile Propertiesmentioning

confidence: 81%

Section: Sn-bi-crmentioning

confidence: 99%

Section: Deformation and Fracture Modementioning

confidence: 99%

Section: Figurementioning

confidence: 99%

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Effects of alloying element on mechanical properties of Sn-Bi solder alloys: a review

Kamaruzzaman

Goh

2022

SSMT

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“…Yang et al confirmed that Ni could improve the ultimate tensile stress and yield stress of Sn58Bi alloy by restraining microstructure coarsening [8]. In fact, the third element, including Zn, Ag, Cu Sb and In, were also added to the Sn58Bi alloy by researchers, and in regard to the tensile strength and breaking elongation results, it is clear that the third element addition is favorable for an improvement in strength and/or ductility [10,11]. The reason for properties improvement could be explained as follows: the addition of a third element increases the liquidus temperature and makes the formation of intermetallic compounds or primary crystals of the added element more likely, and the pre-existing inclusions (IMC or primary crystal) serves as heterogeneous nucleation sites in the matrix during solidification, which effectively refines the microstructures.…”

Section: Introductionmentioning

confidence: 99%

Microstructure and Mechanical Properties of Sn58Bi Components Prepared by Laser Beam Powder Bed Fusion

Yang

Ding

Sun

et al. 2022

Metals

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As a low melting point alloy, Sn58Bi alloy plays a unique role in many fields. However, the brittleness of Sn58Bi alloy is a limitation that has to be addressed for wider applications. According to previous studies, third element addition is favorable for improved ductility, which is attributable to structure refinement. Therefore, laser beam powder bed fusion technology was adopted to prepare Sn58Bi alloy components. Additionally, the as-printed specimens presented more refined structures compared to the as-cast specimen, so they showed better plasticity. The Sn58Bi alloy showed excellent formability when specimens were prepared by LBPBF between 40–80 W. The density of specimens nearly remained stable above laser power higher than 40 W, and CT scanning could not detect internal defects, so the Sn58Bi alloy specimen was likely to be well fabricated at high laser power. Within the laser power range of 40–80 W, with the variation of laser power or scanning velocity, the laser energy density changed accordingly, and the mechanical strength of specimens was improved with the increase of laser power density. This strength change was probably related to the microstructure evolution and internal residual stress in the printing process.

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Effects of Zn contents on microstructure, thermodynamic characteristic and mechanical properties of Sn–Bi-based lead-free solder

Lin

et al. 2022

J Mater Sci: Mater Electron

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The newly developed Sn–Bi–Zn alloy with a low melting point, improved ductility, and high ultimate tensile strength

Cited by 41 publications

References 21 publications

Effects of alloying element on mechanical properties of Sn-Bi solder alloys: a review

Effects of alloying element on mechanical properties of Sn-Bi solder alloys: a review

Microstructure and Mechanical Properties of Sn58Bi Components Prepared by Laser Beam Powder Bed Fusion

Effects of Zn contents on microstructure, thermodynamic characteristic and mechanical properties of Sn–Bi-based lead-free solder

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