The Numerical Approach to Analysis of Microchannel Cooling Systems

Abstract

Abstract. The paper deals with microchannel cooling where water is the cooling liquid. ANSYS software and CFDRC-ACE one were used to analyse the flows and the origin of large amount of heat that can be overtaken from the chip when microchannels are applied. The concept of microscale heat transfer coefficient is discussed. The phenomena taking place in microchannel flows are simulated and some conclusions are introduced to explain the results met in many references but still unexplained. In contrast to existing, standard methods, the new approach describes the local phenomena and is used in the further investigation of the cooling microstructure. An effect of its geometry on the total overtaken heat flux is analysed with respect to optimal conditions as well as to technological restrictions.

Experimental investigation of thermoelectric power generation versus coolant pumping power in a microchannel heat sink

“…In the case of the thermoelectric generators (TEG), for increasing the convective surface area, in order to provide high density of heat dissipation at the surface of the structure, microscale heat transfer systems can enhance the thermal coupling to the hot and cold reservoirs [1]. Therefore, the challenge is to design an effective heat exchanger within microelectronic dimension restrictions [2]. Microscale single-phase heat transfer has been widely used in industrial and scientific applications [3].…”