The Obstruction Effect of Ni Layer on the Interdiffusion of Cu Substrate and Sn Solder: A Theoretical Investigation

Mao, Zhuo; Zhang, Weiwei; Li, Jiesen; Dong, Shengjie; Lin, Xiang; Jian, Xiaodong; Wu, Peng

doi:10.1007/s11664-020-08421-2

Cited by 9 publications

(3 citation statements)

References 48 publications

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“…The diffusion rate of Cu atoms is much greater than that of Sn atoms during the reflow . Therefore, the growth of IMCs in this experiment is mainly because of the diffusion of Cu atoms.…”

Section: Resultsmentioning

confidence: 99%

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Nickel Nanoparticle/Carbon Films as an Interlayer To Improve the Stability of Solder Joints

Lin

Gao

et al. 2023

ACS Appl. Nano Mater.

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The growth of brittle intermetallic compounds (IMCs) generated between a solder and a substrate is crucial for the reliability of solder joints. Therefore, it is necessary to control the growth of IMCs at the interface. Herein, we propose a strategy with the nickel nanoparticle/carbon (Ni&C) films as an interlayer to improve the stability of the solder joint. After adding the interface with the Ni&C film and reflowing for 450 s, the growth of IMCs decreased by 41.05%. After reflowing for 450 and 2100 s, the grain size in the 300 s-Ni&C/Cu substrate decreased by 14.34 and 20.50%, respectively, compared with the pure Cu substrate. Furthermore, the Ni&C film changes the microstructure of the interface and the diffusion pattern of elements, thus reducing the number of Kirkendall voids. As the reflow time increases, the scalloped IMCs are transformed to be prismatic, which can be well explained by the Gibbs–Thomson effect. The synergistic effect between Ni and carbon in Ni&C can jointly control the interface reaction and the growth of IMCs, with the Ni&C film acting as an inert barrier to inhibit the growth of IMCs.

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“…The diffusion rate of Cu atoms is much greater than that of Sn atoms during the reflow . Therefore, the growth of IMCs in this experiment is mainly because of the diffusion of Cu atoms.…”

Section: Resultsmentioning

confidence: 99%

“…The diffusion rate of Cu atoms is much greater than that of Sn atoms during the reflow. 34 Therefore, the growth of IMCs in this experiment is mainly because of the diffusion of Cu atoms. Figure 9a shows a schematic diagram which presents the growth of IMCs at the Sn0.7Cu/Cu interface.…”

Section: Experimental Processmentioning

confidence: 99%

Nickel Nanoparticle/Carbon Films as an Interlayer To Improve the Stability of Solder Joints

Lin

Gao

et al. 2023

ACS Appl. Nano Mater.

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show abstract

“…That is because Cu is a well-known 'fast diffuser' in tin-based alloys. This phenomenon is proposed to be closely related to the Cu metastable solubility and the Cu equilibrium solubility in the smaller size solder [24].…”

Section: Imc Growth For Complex Componentsmentioning

confidence: 96%

Effect of the reflow process on IMC growth for different devices and complex components

Cui¹,

Tian²,

Zhao³

et al. 2022

Smart Mater. Struct.

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Intermetallic compound (IMC), as an inevitable part between pad and solder, has a severe effect on the strength and reliability of microelectronic interconnection. Here, an investigation was carried out on IMC growth for different devices and complex components. The device-level experiments were conducted with five factors: peak temperature, time duration above solder liquidus temperature, the thickness of solder paste, surface finish types, and package types including BGA and QFP. Meanwhile, four complex components with the same reflow profile were conducted and compared for component-level experiments. A scanning electron microscopy was used to measure the thickness and determine the spatial distribution of the elements through the intermetallic compound. The multivariate analysis of the formation and growth of IMC during reflow soldering was studied based on Nernst-Shchukarev's equation and the results of the experiments. The difference in IMC thickness between BGA and QFP with different factors was discussed and compared separately. The results showed that the peak temperature and time above liquidus played a vital role in the IMC growth and the solder paste thickness and different pad metallization could not be ignored. SEM pictures of the solder and statistical results were revealed that the surface finish type has a marked impact on the formation of the IMC. For PCB with numbers of components, the IMC thickness and uniformity of solder joints at corner and center positions showed some regularity differences. Meanwhile, the bump shape (Cu1-xNix)6Sn5 IMC was observed for small size BGA with ENIG during the reflow process. The results have a significant meaning to optimize its reflow process parameters for complex components, to improve the interconnection reliability in engineering.

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Enhancing the properties of the SAC305-soldered joint: heat treatment of the nickel-plated copper substrate before reflow soldering

Deng

Lei

et al. 2022

J Mater Sci: Mater Electron

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The Obstruction Effect of Ni Layer on the Interdiffusion of Cu Substrate and Sn Solder: A Theoretical Investigation

Cited by 9 publications

References 48 publications

Nickel Nanoparticle/Carbon Films as an Interlayer To Improve the Stability of Solder Joints

Nickel Nanoparticle/Carbon Films as an Interlayer To Improve the Stability of Solder Joints

Effect of the reflow process on IMC growth for different devices and complex components

Enhancing the properties of the SAC305-soldered joint: heat treatment of the nickel-plated copper substrate before reflow soldering

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