2015 IEEE 27th International Symposium on Power Semiconductor Devices &Amp; IC's (ISPSD) 2015
DOI: 10.1109/ispsd.2015.7123395
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The optimised design and characterization of 1200 V / 2.0 m&#x2126; cm<sup>2</sup> 4H-SiC V-groove trench MOSFETs

Abstract: V-groove trench MOSFETs with the 4H-SiC{0-33-8} face as the trench sidewall for the channel region have been investigated. The on-resistance and breakdown voltage strongly depend on the aperture ratio of the buried p + regions. The VMOSFETs with the buried p + regions of 71% on a 6-inch wafer exhibited a low specific on-resistance of 2.0 m cm 2 with 1200 V blocking voltage. The threshold voltage is 2.3 V at 175 o C, which shows the VMOSFETs have tolerability for an erroneous ignition under high temperature. Th… Show more

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Cited by 16 publications
(14 citation statements)
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“…In the present article, we apply the aforementioned method to SiO )interfaces have been reported. 3,[29][30][31][32][33] We intend not only to clarify the cause of the dependence of the FE m on crystal faces but also to investigate physical mechanism that limits the mobility in SiO…”
mentioning
confidence: 99%
“…In the present article, we apply the aforementioned method to SiO )interfaces have been reported. 3,[29][30][31][32][33] We intend not only to clarify the cause of the dependence of the FE m on crystal faces but also to investigate physical mechanism that limits the mobility in SiO…”
mentioning
confidence: 99%
“…Many works reported the significant role given by SiO2/SiC interface defects on devices behaviour, due to their impact on mobility and threshold voltage. Importance lies in the correctly modelling their effect [8] and the development of process in order to reduce their density and produce devices with superior performances [12]. Traps concentration could vary within some orders of magnitude depending on the quality of technology process.…”
Section: Resultsmentioning
confidence: 99%
“…A second n-layer is regrown, and the MOS-structure is then fabricated at the surface in the same manner as a conventional SiC IGBT Such regrowth technique has been demonstrated by industry for the fabrication of SiC MOSFET. 22,23 Figure 8a shows the turn-off characteristics of the IGBTs. The test circuit is illustrated in Figure 8b for the mixed-mode TCAD simulations.…”
Section: Device Mechanism and Performancesmentioning
confidence: 99%