The Optimization of Reflow Soldering Temperature Profile Based on Simulation

Gong, Yubing; Li, Quanyong; Yang, Daoguo

doi:10.1109/icept.2006.359831

Cited by 11 publications

(7 citation statements)

References 3 publications

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“…This includes temperature adjustments in various zones, conveyor belt speed, airflow, etc. [14] to achieve the appropriate process requirements and ensure a higher yield of good-quality products.…”

Section: Establishing Accurate Simulation Modelmentioning

confidence: 99%

Optimization Method for Hot Air Reflow Soldering Process Based on Robust Design

Ran,

Chen,

Chen

et al. 2023

Processes

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The process design of hot air reflow soldering is one of the key factors affecting the quality of PCBA (Printed Circuit Board Assembly) component products. In order to improve the product quality during the design process, this paper proposes a robust optimization-based finite element simulation analysis method including significant influencing factor screening, robustness evaluation, robust optimization, and reliability verification for the reflow soldering process. The simulation model of the reflow soldering process temperature field based on experiments is constructed and validated. Sensitivity analysis is used to select important influencing factors, such as the last five set temperature zones (T5 to T9) in the reflow oven and the thermal properties of materials such as PCBs (printed circuit boards), BGAs (ball grid arrays), and solder paste, as well as noise factors like the heating environment during the soldering process. Several surrogate models are used to construct the response surface, and the optimal fitting scheme is selected to effectively avoid poor fitting caused by inappropriate surrogate models. The 6σ robust optimization approach is introduced to evaluate and optimize the robustness of the process design parameter where the heating factor is chosen as the optimization target. The reliability analysis method is employed to validate the product quality. This paper establishes a comprehensive robustness analysis method for hot air reflow soldering, effectively reducing design costs and addressing the lack of robustness analysis in the current hot air reflow soldering process design.

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Section: Establishing Accurate Simulation Modelmentioning

confidence: 99%

Optimization Method for Hot Air Reflow Soldering Process Based on Robust Design

Ran,

Chen,

Chen

et al. 2023

Processes

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show abstract

“…The optimum values of the designed parameters of the package were determined based on that methodology. The FEM approach was reported by Gong et al (2006) to optimize the reflow profile of a BGA package by reducing the maximum thermal stress of a package. The optimization algorithm was coded in ANSYS to solve the objective mentioned before.…”

Section: Challenges In Optimization Of the Reflow Soldering Processmentioning

confidence: 99%

Thermo-mechanical challenges of reflowed lead-free solder joints in surface mount components: a review

Lau¹,

Khor

Soares

et al. 2016

SSMT

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Purpose The purpose of the present study was to review the thermo-mechanical challenges of reflowed lead-free solder joints in surface mount components (SMCs). The topics of the review include challenges in modelling of the reflow soldering process, optimization and the future challenges in the reflow soldering process. Besides, the numerical approach of lead-free solder reliability is also discussed. Design/methodology/approach Lead-free reflow soldering is one of the most significant processes in the development of surface mount technology, especially toward the miniaturization of the advanced SMCs package. The challenges lead to more complex thermal responses when the PCB assembly passes through the reflow oven. The virtual modelling tools facilitate the modelling and simulation of the lead-free reflow process, which provide more data and clear visualization on the particular process. Findings With the growing trend of computer power and software capability, the multidisciplinary simulation, such as the temperature and thermal stress of lead-free SMCs, under the influenced of a specific process atmosphere can be provided. A simulation modelling technique for the thermal response and flow field prediction of a reflow process is cost-effective and has greatly helped the engineer to eliminate guesswork. Besides, simulated-based optimization methods of the reflow process have gained popularity because of them being economical and have reduced time-consumption, and these provide more information compared to the experimental hardware. The advantages and disadvantages of the simulation modelling in the reflow soldering process are also briefly discussed. Practical implications This literature review provides the engineers and researchers with a profound understanding of the thermo-mechanical challenges of reflowed lead-free solder joints in SMCs and the challenges of simulation modelling in the reflow process. Originality/value The unique challenges in solder joint reliability, and direction of future research in reflow process were identified to clarify the solutions to solve lead-free reliability issues in the electronics manufacturing industry.

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“…Moreover, the set temperature of each zone and the conveyor speed play a crucial role in the quality of products. erefore, how to adjust and control them reasonably, especially the optimization of the temperature profile, has been a research focus [2][3][4][5][6]. At present, most work in this field is checked and adjusted by experimental tests, for lack of a complete theoretical model.…”

Section: Introductionmentioning

confidence: 99%

“…In fact, the mainstream was the finiteelement method (FEM) with advantages that there is no need to consider the complex differential equations and unintelligible physical concepts. While there was a fact that its accuracy was incomparable, the computation was particularly enormous [5,[9][10][11][12][13]. e surface temperature of the motherboard on flexible printed circuit boards was predicted using the simulation software ANSYS, though the reliability of the results still needs further experimental verification [14].…”

Section: Introductionmentioning

confidence: 99%

“…By applying simulation software, the computational fluid dynamics (CFD) models of reflow soldering were also tried [10][11][12]15]. On the other hand, as the reflow soldering model becomes more accurate, on the basis of the temperature profile, the evaluation of soldering quality and optimization of relevant parameters, such as the heat transfer coefficient, heat flow, and reflux cooling time, have gradually been developed [5,16]. For example, a linear regression model derived from the least-squares estimation methodology was utilized for describing the discovery that the heating factor Q η is approximately linear with changes in combined parameters H t , providing a simple way for optimization based on the heating factor [4], which was a significant factor of the evaluation of solder joint quality and the bismuth/tin solder intermetallic layers too [6,17].…”

Section: Introductionmentioning

confidence: 99%

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Effects of the Solder Phase Transformation on the Optimization of Reflow Soldering Parameters and Temperature Profiles

Liu

Zhang

2021

Discrete Dynamics in Nature and Society

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In this study, a heat convection model of the reflow oven and a heat conduction model of the soldering area are proposed based on heat transfer theory, and a dynamic Thomas algorithm is developed for solving linear equations with coefficient matrix evolving over time in the tridiagonal system, which is derived from a heat transfer problem with moving boundaries in the solder phase transition process. We have also carried out numerical simulations for investigating the accuracy of the mathematical model, in which the temperature profiles are calculated and compared for different cases with considering or ignoring phase transformations, respectively. Parameters of reflow soldering, such as the conveyor speed, the set temperature in each zone, and a part of the heating factor, are optimized by the use of the nondominated sorting genetic algorithm II. By comparing the temperature profile and optimal solutions in the two cases, numerical results show that phase transitions of the solder have great impacts on optimal parameters and the slope of temperature profiles. Moreover, the phenomenon that the heating factor varies with the maximum set temperature in a banded distribution is investigated and analyzed, which is an important part of this work.

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The Optimization of Reflow Soldering Temperature Profile Based on Simulation

Cited by 11 publications

References 3 publications

Optimization Method for Hot Air Reflow Soldering Process Based on Robust Design

Optimization Method for Hot Air Reflow Soldering Process Based on Robust Design

Thermo-mechanical challenges of reflowed lead-free solder joints in surface mount components: a review

Effects of the Solder Phase Transformation on the Optimization of Reflow Soldering Parameters and Temperature Profiles

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