The Paradoxical Role of Sulphur in Molding Compounds: Influence on High Temperature Reliability of Cu-Al Wirebond Interconnects

Mavinkurve, A.; Goumans, L.; Farrugia, Mark Luke; Olst, E. van; Soestbergen, M. van; Rongen, R.T.H.; Bumrungkittikul, B.

doi:10.1109/ectc.2017.252

Cited by 8 publications

(5 citation statements)

References 12 publications

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“…The additives incorporated into EMC are intended to improve its mechanical and physical properties. EMC varies in terms of the density of the fibers, length, and composition and effectively protects semiconductor circuits from heat, shock, and moisture [ 10 ]. In contrast to EMC, silicon is more brittle.…”

Section: Methodsmentioning

confidence: 99%

Mode I Fatigue and Fracture Assessment of Polyimide–Epoxy and Silicon–Epoxy Interfaces in Chip-Package Components

Morais,

Akhavan-Safar,

Carbas

et al. 2024

Polymers

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Semiconductor advancements demand greater integrated circuit density, structural miniaturization, and complex material combinations, resulting in stress concentrations from property mismatches. This study investigates the failure in two types of interfaces found in chip packages: silicon–epoxy mold compound (EMC) and polyimide–EMC. These interfaces were subjected to quasi-static and fatigue loading conditions. Employing a compliance-based beam method, the tests determined interfacial critical fracture energy values, (GIC), of 0.051 N/mm and 0.037 N/mm for the silicon–EMC and polyimide–EMC interfaces, respectively. Fatigue testing on the polyimide–epoxy interface revealed a fatigue threshold strain energy, (Gth), of 0.042 N/mm. We also observed diverse failure modes and discuss potential mechanical failures in multi-layer chip packages. The findings of this study can contribute to the prediction and mitigation of failure modes in the analyzed chip packaging. The obtained threshold energy and crack growth rate provide insights for designing safe lives for bi-material interfaces in chip packaging under cyclic loads. These insights can guide future research directions, emphasizing the improvement of material properties and exploration of the influence of manufacturing parameters on delamination in multilayer semiconductors.

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Section: Methodsmentioning

confidence: 99%

Mode I Fatigue and Fracture Assessment of Polyimide–Epoxy and Silicon–Epoxy Interfaces in Chip-Package Components

Morais,

Akhavan-Safar,

Carbas

et al. 2024

Polymers

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“…The elastic properties of the oxidized layer at each ageing configuration were derived from the experimental data using the flexural equation extended for multi-material composite beams [7]. In this case, the cross-section of a partially-oxidized beam specimen consists of a 'core' pristine layer (thickness h pr ) sandwiched between two 'shell' oxidized layers (thickness h ox each).…”

Section: Elastic Modulus Of Oxidized Emcmentioning

confidence: 99%

“…They, therefore, are not expected to show bending due to the CTE mismatch. Thus, available values of α pr and α eff from the TMA test results were utilized to calculate α ox at different ageing stages using a volume-based weighted average as indicated in the equation ( 5), which has also been used in the previous publication [7].…”

Section: Cte and T G Of Oxidized Emcmentioning

confidence: 99%

“…Thermal ageing is primarily reflected in the oxidation of epoxy moulding compound (EMC) through its contact with atmospheric oxygen, forming a layer of oxidized material up to a certain depth from the exposed surface. It has been established with Fourier Transform Infrared (FT-IR) spectroscopy measurements that the ageing process changes the material chemically [7,8]. Moreover, the changes in thermomechanical properties of thermally aged EMC specimens have also been reported [9,10].…”

Section: Introductionmentioning

confidence: 99%

“…This outer shell exhibits modified thermomechanical properties and changes the mechanical behaviour of the entire package. This can accelerate certain failure modes, such as delamination along the EMC-die interface, cracks in the bulk of EMC [7], and fatigue failure of solder joints [15]. Thus, quantifying gradual degenerative changes within EMC (here, determining the current stage of EMC oxidation) becomes crucial.…”

Section: Introductionmentioning

confidence: 99%

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A Continuously Updated Package-Degradation Model reflecting Thermomechanical Changes at Different Thermo-Oxidative Stages of Moulding Compound

Inamdar

Soestbergen

Mavinkurve

et al. 2023

2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and

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Moulding compounds used for encapsulating electronics typically occupy a large portion of package volume and are most exposed to the external environment. Under harsh conditions such as high temperature, humidity, and mechanical vibrations, constituent materials of electronic components degrade, resulting in a change in their thermal, mechanical, electrical, and chemical behaviour. High-temperature ageing of electronic packages causes the oxidation of epoxy moulding compounds (EMC), forming a layer exhibiting significantly different thermomechanical properties. This reflects in the modified mechanical behaviour of the entire package, which accelerates certain failure modes and affects component reliability. Thus, it is crucial to consider gradual degenerative changes in EMC for a more accurate estimation of the component lifetime.This paper proposes a three-step modelling approach to replicate thermo-chemical changes in package encapsulation. A parametric geometry of a test package was incorporated with the ageing stage-dependent changes in thermomechanical properties of the oxidized layer. The mechanical behaviour of oxidized EMC at multiple stages of thermal ageing (at 150 • C for up to 3000 hours) was first experimentally characterized and then validated using warpage measurements on thermally aged test packages and Finite Element (FE) simulations. Lastly, a trendbased interpolation of material model parameters for intermediate stages of ageing was followed, and a continuously updated degradation model (physics-based Digital Twin) was achieved. The proposed model is capable of reproducing degraded stages of the test package under thermal ageing along with its modified thermomechanical behaviour. Its limitations and significance in the domain of health monitoring of microelectronics are also discussed.

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Reliability and Failure of Microelectronic Materials

Mavinkurve

Rongen

Soestbergen

2022

Reliability of Organic Compounds in Microelectronics and Optoelectronics

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The Paradoxical Role of Sulphur in Molding Compounds: Influence on High Temperature Reliability of Cu-Al Wirebond Interconnects

Cited by 8 publications

References 12 publications

Mode I Fatigue and Fracture Assessment of Polyimide–Epoxy and Silicon–Epoxy Interfaces in Chip-Package Components

Mode I Fatigue and Fracture Assessment of Polyimide–Epoxy and Silicon–Epoxy Interfaces in Chip-Package Components

A Continuously Updated Package-Degradation Model reflecting Thermomechanical Changes at Different Thermo-Oxidative Stages of Moulding Compound

Reliability and Failure of Microelectronic Materials

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