The performance and evaluation of thin film insulating crossovers

Richardson, W.W.; Greenhouse, Harold M.; Vergara, William Charles

doi:10.1016/0026-2714(68)90014-0

Cited by 5 publications

(2 citation statements)

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“…In the first group, the two conductors are in intimate contact with the dielectric. Materials such as organic photoresist [41], silicon monoxide [42], silicon dioxide [43], and various glasses [44] have been used as the dielectric. A detailed study using Si0 and various metal combinations was made by Richardson et al [42].…”

Section: Substratesmentioning

confidence: 99%

Interconnection systems for solid-state components in hybrid integrated circuits

Basseches¹

1971

Proc. IEEE

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The factors which can influence the performance and reliability of the interconnection system for solid-state components in hybrid integrated circuits are examined. The main emphasis is on materials that have received most attention in the tantalum film and silicon technologies in the Bell System. However, other materials that are being used are discussed. The interrelation of various factors in choosing an interconnection system is discussed. These factors include the composition of the materials, the methods of depositing various metals, and the properties of the substrates. Among the properties of the materials that are considered. emphasis is laid on environmental stability. The results of environmental tests on conductors and thin-film resistors under high-humidity conditions are reported. Some results on the use of silicone rubber as an encapsulant indicate this material is effective in reducing degradative action on hybrid circuits.

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Section: Substratesmentioning

confidence: 99%

Interconnection systems for solid-state components in hybrid integrated circuits

Basseches¹

1971

Proc. IEEE

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“…Breakdown probability is dependent on the capacitor area. , 2,4 The relation is p e-YA (1) where 7 is the density of the defects/weak points/, A is the capacitor area.…”

Section: Introductionmentioning

confidence: 99%