The Plating Rates and Physical Properties of Electroless Nickel/Phosphorus Alloy Deposits

Baldwin, Charles A.; Such, T.E.

doi:10.1080/00202967.1968.11870052

Cited by 41 publications

(6 citation statements)

References 5 publications

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“…Table 4 shows the effect of pH change on EN plating process. According to Baldwin et al [32], the temperature of plating bath will increased to the normal operating range when the content of phosphorous is decreased. Due to their properties, the phosphorous content may easy to control.…”

Section: ) Hydrazinementioning

confidence: 99%

Electroless and Immersion Plating Process towards Structures and IMC Formation

Adawiyah¹,

Azlina²,

Fadil³

et al. 2016

IJET

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Abstract-The selection of surface finish on printed circuit board is very important in soldering process because it can prevent the copper from oxidation and provide solderable surface. It is also will influence the cost, manufacturing, shelf life, surface quality, final product reliability and environment.Electroless and immersion plating process has now become an important and popular surface finish in electronic industry due to simple and low cost process. The application of electroless plating are widely used in electronic industry, however it also was used in various industries such as aerospace, automotive, oil and gas, chemical processing where the need on the complex shape, homogeneous and uniform layer are required. Besides, every surface finish has their strength and weakness. Immersion silver is one of the surface finishes frequently used on the printed circuit board due to their characteristics such as good solderability and wettability, easy assembly and low cost. Both of these two processes were acts as barrier layer between copper substrate and solder balls. This review was discussed about electroless nickel and immersion silver plated on copper substrate, coating process and parameters involved. The topic also covered include the morphology and thickness of the intermetallics formed during soldering as well as the isothermal aging process.

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Section: ) Hydrazinementioning

confidence: 99%

Electroless and Immersion Plating Process towards Structures and IMC Formation

Adawiyah¹,

Azlina²,

Fadil³

et al. 2016

IJET

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“…The nickel concentration of most commercial hypophosphite based electroless nickel baths lies in the range of 5.5-7.0 g/L. Baldwin and Such 4 have found that when the nickel concentration is equal to or greater than approximately 5 g/L, it has little or no effect on the deposition rate, which implies that the cathodic partial reaction is not diffusion limited but kinetically controlled by electrode potential and catalytic activity.…”

mentioning

confidence: 99%

“…Regarding the diffusion of stabilizer, if its concentration gradient in the vicinity of a surface is of a laminar profile (linear diffusion), the diffusion flux is perpendicular to the surface and can be expressed by equation 6 J ϭ DC 0 /␦ [4] Where D, C 0 , and ␦ stand for the diffusion constant, the concentration in bulk solution, and the thickness of the diffusion layer, respectively. In the absence of forced convection, the value of ␦ is usually in the order of 100 m. 6 However, Eq.…”

mentioning

confidence: 99%

Stabilizer Concentration and Local Environment: Their Effects on Electroless Nickel Plating of PCB Micropads

Zhang

Baets

Vereeken

et al. 1999

J. Electrochem. Soc.

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With the advent of flip chip assembly, pads to be plated on printed circuit boards (PCBs) have shrunk dramatically to around 100×100 μm2 . As a result, most commercial electroless nickel baths will fail to deposit nickel on such small micropads. In this paper, using a specially designed PCB layout, the effects of Pb2+ concentration and local environment are studied. A competition mechanism between two opposite actions, the adsorption from bulk solution by diffusion and the burying by nickel deposition, is used to explain the effect of Pb2+ as a catalytic inhibitor. On a constantly growing surface, the dynamic density of adsorbed Pb2+ is the net result of these two opposite actions. Using this competition mechanism, the skipping problem of micropads is attributed to the combined result of nonlinear diffusion and high concentration of Pb2+ in the bulk solution. This competition mechanism also gives a new explanation for the effect of potential pinning. In the case of potential pinning, galvanic effect by electrons flowing from one area to another only exists during the initial period of nickel deposition. Once it is started, nickel deposition on any area is maintained by the electroless process, and hence, is actually self‐supporting, By reducing the bulk concentration of Pb2+ to a lower range in a commercial bath, we have realized consistent nickel plating on micropads as fine as 50 μm in diameter. © 1999 The Electrochemical Society. All rights reserved.

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“…The comparison of the effect of reducing agent concentration on the phosphorus contented between the previous study [25] However, the conductive surface of FPCBs produced from copper is easy to be oxidized and damaged by solder. Therefore, surface finishing is required.…”

Section: Figure 57mentioning

confidence: 76%

“…Figure5 7. The comparison of the effect of reducing agent concentration on the phosphorus contented between the previous study[25] and lab experiment…”

mentioning

confidence: 99%

The Study of Effects and Mechanisms of Industrial Controlled Factors on Electroless Nickel Immersion Gold (Enig) Plating Process

Pattarakiatikun

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This research aimed to study the effects of the factors and mechanisms which were controlled by the industry on the electroless nickel immersion gold (ENIG) process including pretreatment step and condition used in ENIG. The thickness analysis of nickel and gold layers by X-ray fluorescence spectrometry (XRF) found that increasing the concentration of precursors, chelating agents, the alkalinity in the controlled range, temperature, and decreasing of oxides on the surface of the substrate resulting in a thick layer of nickel and gold. Also the phosphorus on the nickel substrate caused the thinner layer of gold. For the Ni/P alloy, the nickel composition ratio measured by energy dispersive X-ray spectrometer (EDX) would be greater due to increasing of nickel salt, alkalinity in the EN plating solution or temperature. However, increasing the temperature more than 90 oC caused decomposition of EN plating solution. Moreover, the decreasing of reducing agent resulted in increasing of nickel composition ratio of nickel alloy. The factors affected the roughness and morphology of the nickel surface measured by scanning electron microscopy (SEM) and stylus containing the morphology of the substrate, the gas bubbles generated by the plating reaction which affected the flow of the plating solution and agitation. In the case of gold roughness was based on the nickel surface roughness. The too thick gold plating layer resulted in the dropping of the adhesion between gold layer and nickel surface. The sensitive parameters of EN plating were by-product of plating reaction and pH of EN solution. For IM plating, the sensitive parameter was pH of IM plating solution.

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The Plating Rates and Physical Properties of Electroless Nickel/Phosphorus Alloy Deposits

Cited by 41 publications

References 5 publications

Electroless and Immersion Plating Process towards Structures and IMC Formation

Electroless and Immersion Plating Process towards Structures and IMC Formation

Stabilizer Concentration and Local Environment: Their Effects on Electroless Nickel Plating of PCB Micropads

The Study of Effects and Mechanisms of Industrial Controlled Factors on Electroless Nickel Immersion Gold (Enig) Plating Process

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