One possible failure mechanism of products containing polyimide dielectric is deadhesion of polyimide from neighboring metallization. Deadhesion usually occurs due to the combined damage mechanisms of environmental aging and fatigue. In this paper, the rate of aging of Kapton-E polyimide is quantified as a function of temperature and humidity exposure using peel and tensile tests. An accelerated test methodology that accounts for both aging and fatigue and that can be used to evaluate the resistance of electronic products to polyimide deadhesion is then proposed.
MurrayPage 3 to prevent copper from diffusing into polyimide and to provide protection against corrosion. Adhesion between polyimide and metallization results from van-der-Waals forces, mechanical interlocking, and the formation of metal-polymer complexes (chemical bonding) with the barrier metallization [15,[29][30][31][32].Adhesion of polyimide to itself, in contrast, is due to cross-linking, chain tangling, van-der-Waals forces, and acid-base interactions [15].Plasma treatment of polyimide is commonly used prior to metal deposition in order to improve the adhesion of the polyimide to the metallization. Adhesion is improved through the removal of surface contamination, chemical modification of the polyimide that creates active groups available for bonding to the metallization, and texturing of the polyimide surface that results in greater mechanical interlocking between the materials [20].
DEADHESION OF POLYIMIDE DIELECTRICIn order to operate reliably, the materials in a metal-polyimide multi-layer structure must stay adhered together throughout the life of the product. Deadhesion can result in impedance changes between transmission lines, as well as increased susceptibility to via fracture, corrosion, and conductive filament formation. Metal-polyimide interfacial strength exceeds that of the bulk polyimide when plasma pretreatment of polyimide is performed and barrier metallization is used, such that deadhesion occurs by crack propagation through the bulk of the polyimide dielectric in the near-interface region [17][18][19][20][21]23].Product failure can also occur due to the formation of cracks within bulk polyimide as the material becomes more brittle with aging. For example, cracks in polyimide wire insulation resulting from aging, through which electrical arcs could pass, have been blamed for the crashes of TWA flight 800 off Long Island in 1996, and Swissair flight 111 near Nova Scotia in 1998 [11].
Polyimide agingThe primary environmental aging mechanisms of polyimide are hydrolysis and thermo-oxidative degradation [8]. Polyimide film becomes more rigid and brittle during aging, and breaks at lower stresses and ultimate elongations [5][6][7][8][9][10]. Aging of metallized polyimides decreases the peel strength of the metallization [16,[18][19][20][21].