1995
DOI: 10.1016/0368-2048(95)02351-8
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The polyimide (PMDA-ODA) titanium interface. Part 2. XPS study of polyimide treatments and ageing

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Cited by 24 publications
(13 citation statements)
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“…It is also found that the APP-treated PI films at high treatment power show less aging effect than PI-150. This result indicates that the films at high APP power probably have enough energy to form intermolecular bonds between the newly produced oxygen complex and the film surfaces [26].…”
Section: Surface Free Energies Of App-treated Pi Filmsmentioning
confidence: 97%
“…It is also found that the APP-treated PI films at high treatment power show less aging effect than PI-150. This result indicates that the films at high APP power probably have enough energy to form intermolecular bonds between the newly produced oxygen complex and the film surfaces [26].…”
Section: Surface Free Energies Of App-treated Pi Filmsmentioning
confidence: 97%
“…5, the typical peak of -CF 3 with binding energy of 293.6 eV (C 4 ) confirms the successful introduction of DFMA. Furthermore, the peaks with the binding energy of 285.0 eV (C 1 ), 286.9 eV (C 2 ) and 288.9 eV (C 3 ) can be attributed to C-C, COO [24] and NCOO(C-F) [25,26], respectively. The percentages of functional groups are listed in Table 3.…”
Section: Surface Chemical Compositions Analysismentioning
confidence: 99%
“…Deadhesion can result in impedance changes between transmission lines, as well as increased susceptibility to via fracture, corrosion, and conductive filament formation. Metal-polyimide interfacial strength exceeds that of the bulk polyimide when plasma pretreatment of polyimide is performed and barrier metallization is used, such that deadhesion occurs by crack propagation through the bulk of the polyimide dielectric in the near-interface region [17][18][19][20][21]23].…”
Section: Deadhesion Of Polyimide Dielectricmentioning
confidence: 99%
“…Deadhesion can result in impedance changes between transmission lines, as well as increased susceptibility to via fracture, corrosion, and conductive filament formation. Metal-polyimide interfacial strength exceeds that of the bulk polyimide when plasma pretreatment of polyimide is performed and barrier metallization is used, such that deadhesion occurs by crack propagation through the bulk of the polyimide dielectric in the near-interface region [17][18][19][20][21]23].Product failure can also occur due to the formation of cracks within bulk polyimide as the material becomes more brittle with aging. For example, cracks in polyimide wire insulation resulting from aging, through which electrical arcs could pass, have been blamed for the crashes of TWA flight 800 off Long Island in 1996, and Swissair flight 111 near Nova Scotia in 1998 [11].…”
mentioning
confidence: 99%
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