physics, and engineering. One of the key points lies in the development of flexible substrate materials and efficient packaging technology. The components of organic light-emitting devices (OLEDs) or organic photovoltaics (OPV), including the cathode materials and photoelectric conversion layer, are reactive; thus, thin films should encapsulate both the top and bottom surfaces of the devices to realize the desired property. [2-4] Barrier-coated plastic lids, ultrathin glasses, and vacuumdeposited thin films have been developed as thin-film encapsulation (TFE) approaches. [5] However, there are many issues with the current manufacturing methods for encapsulation films. The laser lift-off (LLO) process is widely used for flexible electronics manufacturing, requires evaporating each functional layer onto a substrate, then peeling the devices off the substrate using a laser; the product yield is high, but the productivity is low. In contrast, roll-to-roll (R2R) processing, which involves directly assembling the devices on a formed substrate, is more suitable for large-scale industrial production. [6,7] There are demanding performance requirements for the encapsulation film, such as light transmittance, flexibility, gas impermeability, and heat resistance. The encapsulation film in the direction of light transmission should be highly transparent. [8,9] The other functional layers in electronic devices can be fabricated with nanoscale thickness; thus, the flexibility of the completed devices mainly depends on the properties of the encapsulation materials. Encapsulation materials have gradually developed from rigid glass plates to flexible thin films in recent years. [6,10] The degree of gas permeability is the most important property of TFE materials because flexible electronics use reactive metals and organic matters in devices. It is generally required that the water vapor transmission rate (WVTR) and oxygen transmission rate (OTR) should be on the order of 10 −3-10 −6 g m −2 day −1 to provide flexible electronics to have a sufficient service life. [11,12] Furthermore, OLEDs, for example, use thin-film transistors (TFTs) to control brightness and grayscale. A flat/smooth surface (roughness average R a < 1 nm) is beneficial for the fabrication of its nanostructures, and as the manufacturing temperature of TFTs is very high, A good packing of flexible electronics is one of the most critical points to ensure its lifetime. However, efficient and straightforward packaging technology is still very challenging. In this work, a new strategy for preparing encapsulation film is reported by "enameling" a fusible glass layer on a polymer membrane. Careful consideration has been given to the materials properties and manufacturing process, and the obtained glass-coated polymer can combine the advantageous properties of polymers and inorganic materials unconventionally. The encapsulation films show exceptional overall properties, including transparency (<5% optical deterioration), flexibility (radius of curvature: 1.5 mm), and low ...