The reactive route to ceramic joining: Fabrication, interfacial chemistry and joint properties

Peteves, S. D.; Paulasto, M.; Ceccone, Giacomo; Stamos, V.

doi:10.1016/s1359-6454(98)80023-2

Cited by 39 publications

(38 citation statements)

References 11 publications

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“…Partial transient liquid-phase (PTLP) bonding [1][2][3][4][5][6][7][8][9][10][11] is one potential avenue towards this goal, offering lower processing temperatures and/or pressures than conventional diffusion bonding while providing joints that can retain appreciable strength at elevated temperatures.…”

Section: Introductionmentioning

confidence: 99%

Fracture and Fatigue Behavior at Ambient and Elevated Temperatures of Alumina Bonded with Copper/Niobium/Copper Interlayers

Kruzic

Marks

Yoshiya

et al. 2002

Journal of the American Ceramic Society

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Interfacial fracture toughness and cyclic fatigue-crack growth properties of joints made from 99.5% pure alumina partial transient-liquid phase bonded using copper/niobium/copper interlayers have been investigated at both room and elevated temperatures, and assessed in terms of interfacial chemistry and microstructure. The mean interfacial fracture toughness, G c , was found to decrease from 39 to 21 J/m 2 as temperature was raised from 25° to 1000°C, with failure primarily at the alumina/niobium interfaces. At room temperature, cyclic fatigue-crack propagation occurred at both the niobium/alumina interface and in the alumina adjacent to the interface, with the fatigue threshold, ∆G TH , ranging from 20 -30 J/m 2 ; the higher threshold values in that range resulted from a predominantly near-interfacial (alumina) crack path. During both fracture and fatigue failure, residual copper at the interface deformed and remained adhered to both sides of the fracture surface, acting as a ductile second phase, while separation of the niobium/alumina interface appeared relatively brittle in both cases. The observed fracture and fatigue behavior is considered in terms of the respective roles of the presence of ductile copper regions at the interface which provide toughening, extrinsic toughening due to grain bridging during crack propagation in the alumina, and the relative crack propagation resistance of each crack path, including the effects of segregation at the interfaces found by Auger spectroscopy.

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Section: Introductionmentioning

confidence: 99%

Fracture and Fatigue Behavior at Ambient and Elevated Temperatures of Alumina Bonded with Copper/Niobium/Copper Interlayers

Kruzic

Marks

Yoshiya

et al. 2002

Journal of the American Ceramic Society

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“…Joining methods utilizing multilayer metallic interlayers under conditions where a thin or partial layer of a transient liquid phase forms were also proposed [17,18]. The partial transient liquid phase (ptlp) method has been used to join oxide [18][19][20][21][22][23] and nonoxide ceramics [21][22][23][24][25][26].…”

Section: Introductionmentioning

confidence: 99%

Joining of alumina via copper/niobium/copper interlayers

et al. 2000

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Alumina has been joined at 1150°C and 1400°C using multilayer copper/niobium/copper interlayers. Four-point bend strengths are sensitive to processing temperature, bonding pressure, and furnace environment (ambient oxygen partial pressure). Under optimum conditions, joints with reproducibly high room temperature strengths (≈240 ± 20 MPa) can be produced; most failures occur within the ceramic. Joints made with sapphire show that during bonding an initially continuous copper film undergoes a morphological instability, resulting in the formation of isolated copper-rich droplets/particles at the sapphire/interlayer interface, and extensive regions of direct bonding between sapphire and niobium. For optimized alumina bonds, bend tests at 800°C-1100°C indicate significant strength is retained; even at the highest test temperature, ceramic failure is observed. Postbonding anneals at 1000°C in vacuum or in gettered argon were used to assess joint stability and to probe the effect of ambient oxygen partial pressure on joint characteristics. Annealing in vacuum for up to 200 h causes no significant decrease in room temperature bend strength or change in fracture path. With increasing anneal time in a lower oxygen partial pressure environment, the fracture strength decreases only slightly, but the fracture path shifts from the ceramic to the interface. Cu/Nb/Cu Interlayers R. A. Marks et al. Joining of Alumina via

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“…(In some cases, there can be multiple thin layers on each side of the refractory core (see Table 4), but the general principles of the process remain the same.) Upon heating to the bonding temperature, a liquid is formed (through melting or a eutectic reaction with the refractory core [202][203][204][205][206]) by each thin layer. The liquid that is formed wets each ceramic substrate while concomitantly diffusing into the solid refractory core.…”

Section: Ptlp Bonding Processmentioning

confidence: 99%

“…• the dual nature of the multi-layer interlayer combines some beneficial properties of brazing and diffusion bonding [117,188,204,206,208,215] and provides some flexibility in joint design • lower bonding temperatures can mitigate thermally induced stresses [188,214] and limit or avoid deleterious intermetallic reactions [188,207] • because diffusion occurs on a smaller scale (on the order of 100 lm), bonding using slow-diffusing elements occurs in a reasonable amount of time.…”

Section: Advantages and Disadvantages Of Ptlp Bondingmentioning

confidence: 99%

Overview of transient liquid phase and partial transient liquid phase bonding

2011

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Transient liquid phase (TLP) bonding is a relatively new bonding process that joins materials using an interlayer. On heating, the interlayer melts and the interlayer element (or a constituent of an alloy interlayer) diffuses into the substrate materials, causing isothermal solidification. The result of this process is a bond that has a higher melting point than the bonding temperature. This bonding process has found many applications, most notably the joining and repair of Ni-based superalloy components. This article reviews important aspects of TLP bonding, such as kinetics of the process, experimental details (bonding time, interlayer thickness and format, and optimal bonding temperature), and advantages and disadvantages of the process. A wide range of materials that TLP bonding has been applied to is also presented. Partial transient liquid phase (PTLP) bonding is a variant of TLP bonding that is typically used to join ceramics. PTLP bonding requires an interlayer composed of multiple layers; the most common bond setup consists of a thick refractory core sandwiched by thin, lower-melting layers on each side. This article explains how the experimental details and bonding kinetics of PTLP bonding differ from TLP bonding. Also, a range of materials that have been joined by PTLP bonding is presented.

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The reactive route to ceramic joining: Fabrication, interfacial chemistry and joint properties

Cited by 39 publications

References 11 publications

Fracture and Fatigue Behavior at Ambient and Elevated Temperatures of Alumina Bonded with Copper/Niobium/Copper Interlayers

Fracture and Fatigue Behavior at Ambient and Elevated Temperatures of Alumina Bonded with Copper/Niobium/Copper Interlayers

Joining of alumina via copper/niobium/copper interlayers

Overview of transient liquid phase and partial transient liquid phase bonding

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