2018 IEEE 68th Electronic Components and Technology Conference (ECTC) 2018
DOI: 10.1109/ectc.2018.00290
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The Reliability and the Effect of NCA Trapping in Thermo-Compression Flip-Chip Solder Joints Fabricated Using Sn-Ag Solder Capped 40 µm Pitch Cu Pillar Bumps and Low Temperature Curable Non-Conductive Adhesive (NCA)

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Cited by 2 publications
(2 citation statements)
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“…Generally, filler traps in the pillar bump joints substantially led to a contact resistance increase because the contact area between a bump and a Cu pad decreased [ 18 , 19 , 20 , 21 ]. To evaluate the degree of the filler trapping of the Cu/SnAg pillar bump joints quantitatively, the contact resistance was measured and shown in Figure 11 .…”
Section: Resultsmentioning
confidence: 99%
See 1 more Smart Citation
“…Generally, filler traps in the pillar bump joints substantially led to a contact resistance increase because the contact area between a bump and a Cu pad decreased [ 18 , 19 , 20 , 21 ]. To evaluate the degree of the filler trapping of the Cu/SnAg pillar bump joints quantitatively, the contact resistance was measured and shown in Figure 11 .…”
Section: Resultsmentioning
confidence: 99%
“…Lee et al [ 18 ] reported that the surface roughness of the bump significantly affects the amount of filler trapping. Park et al [ 20 ] also reported that a smooth Cu pad sample showed lower filler trapping than a rough Cu pad sample for low-temperature TCB. In this study, the roughness of EPIG was higher than that of ENEPIG surface finish, and the high roughness of the EPIG sample increased the filler trap and the contact resistance.…”
Section: Resultsmentioning
confidence: 99%