The Reliability of the Complex Components under Temperature Cycling, Random Vibration, and Combined Loading for Airborne Applications

Abstract

The electronic devices suffer great vibration and temperature fluctuation in an airborne environment, which has been always a big challenge for reliability design. In this paper, the reliability of the complex electronic components for airborne applications under a thermal cycling test, random vibration and combined loading has been investigated by experiment tests and finite element simulation. The fatigue life and failure location under different loadings have been compared and discussed, respectively. The results indicated that the combined fatigue life was much shorter than a single-factor experiment. The failed solder joints mostly appeared at the interface between the solder and the copper pad on the component side and the location was at the corner for all three harsh environment tests. Nevertheless, several differences could be observed. For temperature cycling, all the specimens failed due to the increase in daisy chain resistance rather than the open circuit for the combined loading test. That is because the degeneration of the solder caused by temperature variation led to lower stress levels and fatigue life. Moreover, the pins fractured at the welding regions have been observed. The modified Coffin—Manson model, Miner’s linear fatigue damage criterion and Steinberg’s model and rapid life-prediction approach were used to predict the fatigue life under temperature cycling, random vibration and combined loading, respectively. With these methods, the accurate numerical models could be developed and validated by experiment results. Thanks to the simulation, the design time could be effectively shortened and the weak point could be determined.

Delamination of Plasticized Devices in Dynamic Service Environments

“…Researchers’ studies on delamination mechanisms have mainly focused on thermal stress damage and moisture damage. Explaining the delamination phenomenon from the stress–strain perspective alone, it has been found that, at the delamination interface, mainly due to the interface between the two phases of the material, the plastic deformation of the two-phase material is formed under the action of the alternating shear stress, which ultimately leads to the failure of delamination [ 8 , 9 , 10 , 11 , 12 , 13 , 14 ]. At the same time, under the intrusion of moisture, ionic contaminants corrode the chip, and moisture thermal expansion is also the main reason for the device to appear to suffer from the “popcorn” effect [ 15 , 16 , 17 , 18 , 19 ].…”

Study on Cavitation, Warpage Deformation, and Moisture Diffusion of Sop-8 Devices during Molding Process

“…An optimization method is proposed to improve the reliability of plastic packaging devices, which can comprehensively consider various influencing factors. This method uses Moldflow and ANSYS (ANSYS_2020R2) and other software; adopts an orthogonal experimental design method, range analysis method, comprehensive weighted analysis method, and other methods; puts forward better technological parameters and structural parameters in the plastic packaging process; and analyzes the influence degree of various factors [18][19][20][21][22]. This method is a universal method that can effectively select the optimal scheme and solve the same kind of problems.…”