The Research of Reactivity between Nano-abrasives and Sapphire during Polishing Process

Abstract

Reactivity between nano-sized abrasives and sapphire wafer has been studied by interfacial solid state reaction during polishing process, and the abrasive with the highest reactivity has been selected from magnesium oxide, silicon dioxide and ferric oxide. Using the Sol-Gel polishing films, sapphire wafers were polished in the form of wet and dry mechanical chemical polishing respectively. The Raman spectra and Grazing incidence X-ray diffraction records show that aluminum silicate with the composition mullite was formed on the polished wafer surface, and silicon dioxide has the highest reactivity than other oxide abrasives under the same conditions during polishing the sapphire substrates.

Role of a New Type Chelating Agent in Chemical Mechanical Polishing of R-Plane Sapphire Substrate

“…While the reaction process is exothermal, this will elevate the polishing temperature and lower the chemical reaction activation energy. According to the Arrhenius equation: 25 V = Kexp (−Ea/RT) [7] Where V is the reaction rate constant; K is the pre-exponential factor; Ea is the activation energy; R is the universal gas constant; and T is the temperature. In the friction state, the activation energy of the chemical reaction on the sapphire surface will be lower under the action of external force, so the reaction rate constant will be higher.…”

“…[3][4][5][6] At present, the requirement of sapphire substrate processing efficiency and precision for LED is higher and higher, because the quality directly affects the light transmittance, reliability, superior products, composite cost and product competitiveness. [7][8][9] However, the research on the theory and techniques of processing is an internationally recognized problem, and it has become the key to competition. 10 As is well-known, sapphire wafer is difficult to be polished ideally owing to its high hardness, brittleness and stable physical and chemical properties.…”

Pollution-Free Approaches for Highly Efficient Sapphire Substrate Processing by Mechanical Chemical Polishing

“…Mechanical chemical polishing (MCP), regarded as an effective processing method for hard-brittle materials, has been explored in many experimental and theoretical investigations [11][12][13]. Used towards the surface finishing of sapphire substrates, this process is an efficient and environmentally friendly approach to acquire high-quality surfaces by removing the reactive layer on the surface of sapphire [12,13].…”

The Synthesis of the Core/Shell Structured Diamond/Akageneite Hybrid Particles with Enhanced Polishing Performance

“…Based on the principle of sol-gel, a semi-fixed abrasive polishing pad with diamond abrasive, called SG polishing pad, is an ideal tool that satisfies the processing demands of various kinds of hard and brittle materials [ 13 , 14 , 15 ]. However, the abrasives easily fall off from the SG polishing tool during process, leading to the low efficiency and short life of the polishing tool.…”