The Response of Electrostatic MEMS Structure under Mechanical Shock and Electrostatic Forces

Abstract

For MEMS devices actuated by electrostatic force, unexpected failure modes can be hardly predicted when the electrostatic force coupled with the shock. A response model is established when a micro cantilever subjected to electrostatic force and mechanical shock. First, based on the theory of transverse forced vibration in vibration mechanics, the equation of motion under shock and electrostatic fore is presented. Then the reduced order model is gained after simplifying by mode superposition method. The computing results indicate that: the shock amplitude and duration are the key factors to affect the reliability of the device; the shock load and electrostatic forces make the threshold voltage much lower than the anticipated value. The micro cantilever may collapse to the substrate even at a voltage far lower than the pull-in voltage. This early dynamic pull-in instability may cause some failures such as short circuit, adhesion or collision damage.

Crack Defect Detection Processing Algorithm and Method of MEMS Devices Based on Image Processing Technology

“…MEMS devices usually work in a resonant state. During the working process, the movable parts carry out cyclic mechanical movements in specific forms, such as stretching, compression, bending, vibration, thermal expansion and thermal contraction [17], the alternating stress will gradually accumulate the fatigue damage of the material, resulting in cracks, and even lead to structural fracture, make the MEMS device unusable. Figure 1 (a) shows that a curved crack is generated inside the MEMS device under high overload.…”