2021
DOI: 10.1016/j.jallcom.2021.161134
|View full text |Cite
|
Sign up to set email alerts
|

The role of AlN thickness in MOCVD growth of N-polar GaN

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
4
1

Citation Types

0
11
0

Year Published

2022
2022
2024
2024

Publication Types

Select...
9

Relationship

2
7

Authors

Journals

citations
Cited by 15 publications
(11 citation statements)
references
References 45 publications
0
11
0
Order By: Relevance
“…The rocking curves as well as the full-width at half-maximum (FWHM) values for GaN (002) and (102) planes are presented in Figure 1 b. The relatively lower FWHM values indicate reduced dislocation densities both for screw and edge components [ 21 , 22 ]. Figure 1 c delineates the omega-2 theta (ω-2 θ) curve of the as-grown sample with the light grey line as the fitted line.…”
Section: Resultsmentioning
confidence: 99%
“…The rocking curves as well as the full-width at half-maximum (FWHM) values for GaN (002) and (102) planes are presented in Figure 1 b. The relatively lower FWHM values indicate reduced dislocation densities both for screw and edge components [ 21 , 22 ]. Figure 1 c delineates the omega-2 theta (ω-2 θ) curve of the as-grown sample with the light grey line as the fitted line.…”
Section: Resultsmentioning
confidence: 99%
“…Therefore, it is an ideal substrate material superior to SiC and sapphire. [7][8][9][10] However, the lack of sufficiently large and perfect single crystals currently limits the development of this substrate material with great potential. As a result, preparing large-size and high-quality bulk AlN single crystals has recently become an important research topic.…”
Section: Introductionmentioning
confidence: 99%
“…Gallium nitride (GaN) is a group III–V semiconductor material with excellent physical and chemical properties, such as high thermal stability, high voltage resistance, and high electron mobility and has been widely used in laser diodes, high-power electronic and microwave devices, high-frequency electronic devices, and UV photodetectors. Currently, the mainstream processes for GaN crystal growth include metal–organic chemical vapor deposition (MOCVD), , gold hydride vapor phase epitaxy (HVPE), , and molecular beam epitaxy (MBE). , Due to their unique physical and chemical properties and increasingly mature preparation systems, GaN material is considered one of the most competitive semiconductor materials in the field of electronics and optoelectronics.…”
Section: Introductionmentioning
confidence: 99%