“…Thereafter, we can conclude the effect of size-reduction ( E ) for InGaN/GaN LEDs as following: where C ( x ) is the alleviated current crowding effect ( Ge et al, 2019 ), P ( x , y ) is the improvement achieved by the increased perimeter-to-area ratio, including improved thermal dissipation and light extraction ( Choi et al, 2003a ; Choi et al, 2003b ), T ( x , y ) is the reduced self-heating and improved heat distribution ( Gong et al, 2010 ; Ploch et al, 2013 ), S ( x , y ) is the enhancement owing to the strain relaxation ( Demangeot et al, 2002 ; Tao et al, 2012 ; Ge et al, 2019 ), and N ( x , y ) is the possible negative effect due to the increased nonradiative recombination ( Gong et al, 2010 ; Stark et al, 2011 ), surface recombination ( Jin et al, 2001 ), and current leakage induced by etching damage and impurities during fabrications ( Jin et al, 2000 ; Stark et al, 2011 ). A more detailed quantitative analysis of the above factors is needed to determine the dominant ones and great precautions must be undertaken to avoid degradation in devices during the growth and fabrication processes for smaller LEDs.…”