2004
DOI: 10.1016/j.jmmm.2004.02.031
|View full text |Cite
|
Sign up to set email alerts
|

The role of nucleation in the evolution of giant magnetoresistance with layer thicknesses in electrodeposited Co–Cu/Cu multilayers

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1
1
1
1

Citation Types

8
45
0

Year Published

2007
2007
2024
2024

Publication Types

Select...
10

Relationship

0
10

Authors

Journals

citations
Cited by 46 publications
(53 citation statements)
references
References 34 publications
(53 reference statements)
8
45
0
Order By: Relevance
“…It has been known, 17 however, that the roughness increases strongly with increasing deposit thickness and recent reports [18][19][20] have shown, on the other hand, that the GMR correlates sensitively with the roughness of ED multilayers. Although in one of our early previous reports, 8 we made a detailed study of GMR as a function of both kinds of layer thickness but in this particular * Electrochemical Society Active Member.z E-mail: bakonyi.imre@wigner.mta.hu case fairly thick (1.7 μm) ED Co/Cu multilayers were prepared on a mechanically polished and, thus, very rough Ti foil substrate so the above mentioned roughness problem may have been pertinent also here. Another deficiency of these previous studies in several cases could have been that electrodeposition was performed in an open cell geometry providing space for edge effects and the cathode position was often vertical.…”
mentioning
confidence: 81%
“…It has been known, 17 however, that the roughness increases strongly with increasing deposit thickness and recent reports [18][19][20] have shown, on the other hand, that the GMR correlates sensitively with the roughness of ED multilayers. Although in one of our early previous reports, 8 we made a detailed study of GMR as a function of both kinds of layer thickness but in this particular * Electrochemical Society Active Member.z E-mail: bakonyi.imre@wigner.mta.hu case fairly thick (1.7 μm) ED Co/Cu multilayers were prepared on a mechanically polished and, thus, very rough Ti foil substrate so the above mentioned roughness problem may have been pertinent also here. Another deficiency of these previous studies in several cases could have been that electrodeposition was performed in an open cell geometry providing space for edge effects and the cathode position was often vertical.…”
mentioning
confidence: 81%
“…The formation of a significant amount of SPM regions in ED multilayers often occurs if both kinds of constituent layers are fairly thin. 27,28 According to Figs. 7c and 7d, for a sufficiently thick (here: 2.4 nm) spacer layer, the observed magnetoresistance indeed mainly arises due to spin-dependent scattering events between well separated FM layers although a small SPM contribution still persists.…”
Section: Gmr In Ed Fe-co/cu Multilayersmentioning
confidence: 99%
“…The higher roughness values for small Cu layer thicknesses may arise from the fact that nucleation of Cu on Co proceeds in an island-like manner 20 and a sufficiently high effective Cu layer thickness should be achieved to ensure a uniform coverage. This mechanism explains clearly the evolution of roughness with t Cu for the G/P series multilayers.…”
Section: D342mentioning
confidence: 99%