Plastic strain relaxation
in epitaxial layers is one of the crucial
factors that limits the performance of III-nitride-based heterostructures.
In this work, we report on strain relaxation and crystalline defects
in heterostructures consisting of compositionally graded AlGaN epitaxial
layers tensile-strained between a GaN-buffer and a GaN-cap. We demonstrate
the effects of Al concentration and the shape of the concentration-depth
profile in the buried graded layers on the accumulated elastic strain
energy and how this influences the critical thickness for crack generation
or fracture. It is shown that this fracture leads to the formation
of partially relaxed regions with their degree of strain relaxation
directly related to the density of cracks. Nevertheless, even though
the in-plane coherency between the AlGaN layer and the GaN-buffer
is broken, the in-plane coherency within the AlGaN layer is preserved
for all regions. Furthermore, the tensile strain released in the buried
graded AlGaN layers is consistent with compressive strain induced
in the GaN-cap layers. Finally, the localized stress and the densities
of threading dislocations are correlated with the features of the
resulting fractured heterostructures. These results are important
toward the control of complex plastic strain relaxation and further
facilitate the growth of high quality compositionally graded AlGaN-based
devices.