2015 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) 2015
DOI: 10.1109/sispad.2015.7292317
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The role of the interface reactions in the electroforming of redox-based resistive switching devices using KMC simulations

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Cited by 11 publications
(10 citation statements)
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“…But there are also different possibilities to create oxygen vacancies in the oxide like, for example, extraction of oxygen via one of the electrodes. [24][25][26] To prove our assumption, the layer stack is modified by a 10 nm thick TiN layer between the hafnium oxide and the top platinum electrode. Furthermore, the thickness of the hafnium oxide is reduced to 15 nm.…”
mentioning
confidence: 90%
See 1 more Smart Citation
“…But there are also different possibilities to create oxygen vacancies in the oxide like, for example, extraction of oxygen via one of the electrodes. [24][25][26] To prove our assumption, the layer stack is modified by a 10 nm thick TiN layer between the hafnium oxide and the top platinum electrode. Furthermore, the thickness of the hafnium oxide is reduced to 15 nm.…”
mentioning
confidence: 90%
“…During this electroforming step, the oxide thin film is reduced by extraction of oxygen via one of the electrodes, and an oxygen-deficient filament is formed. [24][25][26] Alternatively, a sub-stoichiometric oxide layer can be deposited in order to achieve forming-free switching behavior. 27 In this letter, we report our results on wake-up investigations of CSD prepared yttrium doped hafnium oxide.…”
mentioning
confidence: 99%
“…[17] As a matter of fact, the variability of RRAM switching is intrinsic to its operation principle: indeed, the most mature class of RRAM devices is the one that bases its operation on the inherent stochastic processes of formation and disruption of nanometric filamentary regions where metallic ions or defects, which locally reduce the stoichiometry of the insulating layer, activate the electric conduction from one electrode to the opposite. [18][19][20][21][22][23] As the filament dimensions shrinks, according to both device and power scaling requirements, [24,25] variability raises as a consequence. For this reason, applications basing their functionality on device variability are becoming more and more appealing for future high performance and low power computation schemes [14,26] and compact models capturing the operation variability of RRAM devices are gaining importance.…”
Section: Introductionmentioning
confidence: 99%
“…In general, indeed, Monte Carlo simulations that take into account defect generation, diffusion and recombination possibly in combination with complex conduction mechanisms, like the multi-phonon trap assisted tunnelling, reveiled very powerful in describing physical mechanisms of RRAM switching. [18,19,35,36] The novelty of the present work is to show a model based on the solution of RCB networks explaining bipolar resistance switching and which does not require neither the assumption of interface layers with different properties with respect to the bulk of the insulating layer, nor the treatment of complex conduction mechanisms and of ionic drift and diffusion. The simplicity of the simulation allows a low computational load for each device simulation, which is not possible for complex physical phenomenological models that have been developed for describing the switching mechanisms.…”
Section: Introductionmentioning
confidence: 99%
“…This assumption has been tested by an extended version of the model presented in [8] towards the defect formation. The formation of point defects is included using the rate equation (1), see [15,16]. The simulation result changes then with a variable number of defects within the electrolyte, cf.…”
Section: Long Time Scale Investigationmentioning
confidence: 99%