The semi-conductor property and corrosion resistance of passive film on electroplated Ni and Cu–Ni alloys

Wu, Haidong; Wang, Yi; Zhong, Qingdong; Sheng, Minqi; Du, Haiyan; Li, Zhenhua

doi:10.1016/j.jelechem.2011.09.013

Cited by 56 publications

(16 citation statements)

References 31 publications

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“…The negative slope in this region is attributed to p-type behavior and according to Eq 1, acceptor density has been determined from these positive slopes (Ref 14, 15): where e is the electron charge; N A represents the acceptor density for p-type semiconductors (cm À3 ); e stands for the dielectric constant of the passive film [usually taken as 12 for copper and its alloys (Ref 27)]; e 0 denotes the vacuum permittivity; and k, T, and E FB are the Boltzmann constant, absolute temperature, and flat band potential, respectively. The flat band potential can be determined from the extrapolation of the linear portion to C À2 = 0 (Ref [27][28][29]. Table 1 shows the calculated acceptor densities of pure copper specimens (annealed and produced by ARB) in 0.01 M borax solution.…”

Section: Potentiodynamic Polarization Measurementsmentioning

confidence: 99%

Electrochemical and Passive Behaviors of Pure Copper Fabricated by Accumulative Roll-Bonding (ARB) Process

Imantalab

Fattah‐alhosseini

2015

J. of Materi Eng and Perform

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In the present work, electrochemical and passive behaviors of pure copper fabricated by accumulative rollbonding (ARB) process in 0.01 M borax solution (pH = 9.1) have been studied. Before any electrochemical measurements, evaluation of microstructure was obtained by Vickers microhardness, x-ray diffraction (XRD), and transmission electron microscopy. The results of microhardness tests revealed that microhardness values increased with the increasing number of ARB cycles. Also a sharp increase was seen in microhardness after the first ARB cycle, whereas mediocre additional increases were observed afterward up to the seven cycles. Moreover, XRD patterns showed that the mean crystallite size values decrease with the increasing number of ARB cycles. To investigate the electrochemical and passive behaviors of the samples, the potentiodynamic polarization, Mott-Schottky analysis and electrochemical impedance spectroscopy (EIS) were carried out. Polarization plots revealed that as a result of ARB, the corrosion behavior of the specimens improves compared with the annealed pure copper. Also, the Mott-Schottky analysis and EIS measurements showed that the increasing number of ARB cycles offer better conditions for forming the passive films with higher protection behavior, due to the growth of less-defective films.

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Section: Potentiodynamic Polarization Measurementsmentioning

confidence: 99%

Electrochemical and Passive Behaviors of Pure Copper Fabricated by Accumulative Roll-Bonding (ARB) Process

Imantalab

Fattah‐alhosseini

2015

J. of Materi Eng and Perform

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“…where e is the electron charge, N A represents the acceptor density for p-type semiconductors (cm −3 ), ε stands for the dielectric constant of the passive film (usually taken as 12 for copper alloys [10]), ε 0 denotes the vacuum permittivity, k, T , and E FB are the Boltzmann constant, absolute temperature, and flat band potential, respectively [17][18][19][20]. The flat band potential can be determined from the extrapolation of the linear portion to C −2 = 0.…”

Section: Mott-schottky Analysis and Xrd Evaluationsmentioning

confidence: 99%

“…During the last decade, the composition of the passive films has been studied by using different surface characterization analysis [6][7][8][9]. However, the extensive number of researches has been focused on the passivation behavior of copper and its alloys [1][2][3][4][5][6][7][8][9][10], little paper has been published on the semiconducting behavior of the passive films formed on these alloys [10].…”

Section: Introductionmentioning

confidence: 99%

“…Therefore, the electrochemical behavior and passivation of copper and brass in the alkaline solutions needs to be fully understood [10].…”

Section: Introductionmentioning

confidence: 99%

“…A large number of studies have already been reported to explain the properties and mechanism of the passive films on copper and its alloys [1][2][3][4][5][6][7][8][9][10]. However, little information about the effect of pH on the semiconductive behavior of the passive film formed on brass alloys was available.…”

Section: Introductionmentioning

confidence: 99%

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Electrochemical Behavior and Passivation of Cu–30Zn Alloy in Aqueous NaOH Solutions

Fattah‐alhosseini

Alizad

2015

Arab J Sci Eng

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In this work, the electrochemical behavior and passivation of Cu-30Zn alloy in aqueous NaOH solutions was investigated using various electrochemical methods. Potentiodynamic polarization curves showed that increasing NaOH concentration leads to increase corrosion current densities. Mott-Schottky analysis indicated that the passive films displayed p-type semiconductive characteristics and the acceptor densities increased by increasing NaOH concentration, while the flat band potential decreased. Moreover, electrochemical impedance spectroscopy studies showed that the impedance value decreased by increasing NaOH concentration, due to increase in the Zn dissolution of Cu-30Zn alloy, which is consistent with the results of the polarization experiment and X-ray diffraction patterns.

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Flexible Interconnected Cu‐Ni Nanoalloys Decorated Carbon Nanotube‐Poly(vinylidene fluoride) Piezoelectric Nanogenerator

Badatya

Kumar

Srivastava

et al. 2022

Adv Materials Technologies

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Herein, high‐performance flexible and stable Cu‐Ni nanoalloy decorated carbon nanotube (CNT) reinforced poly(vinylidene fluoride) (PVDF) based piezoelectric nanogenerator is presented for the first time with very high current and power density. The formation of crystalline β‐phase is confirmed using FT‐IR and Raman spectra analysis. HR‐TEM study reveals the formation of Cu‐Ni nanoalloys with well‐defined interconnected structure with CNT. The Cu‐Ni nanoalloy decorated CNT‐PVDF nanogenerator device exhibits a high output voltage of 12 V and high current density of 0.3 µA cm−2 compared to pristine PVDF nanogenerator (4 V and 10 nA cm−2). Very high power density of 204 µW cm−3 is obtained from the nanocomposite nanogenerator. Piezoelectric force microscopy study reveals very high piezoelectric charge coefficient (d33) of about 160 pm V−1 from Cu‐Ni decorated CNT‐PVDF. Very stable output performance with almost no degradation till 1500 cycles is observed from the Cu‐Ni nanoalloy CNT‐PVDF nanogenerator. Such high stability is due to its dramatic improved high tensile strength of 60 MPa. Very high dielectric constant of 500 is observed from Cu‐Ni decorated CNT‐PVDF as compared to pristine PVDF (ε’ ≈ 20). The dramatic increase in output performance even under without electrical poling is discussed in light of self‐dipole alignment, in‐situ poling, high d33, interfacial polarization, and enhanced dielectric properties.

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The semi-conductor property and corrosion resistance of passive film on electroplated Ni and Cu–Ni alloys

Cited by 56 publications

References 31 publications

Electrochemical and Passive Behaviors of Pure Copper Fabricated by Accumulative Roll-Bonding (ARB) Process

Electrochemical and Passive Behaviors of Pure Copper Fabricated by Accumulative Roll-Bonding (ARB) Process

Electrochemical Behavior and Passivation of Cu–30Zn Alloy in Aqueous NaOH Solutions

Flexible Interconnected Cu‐Ni Nanoalloys Decorated Carbon Nanotube‐Poly(vinylidene fluoride) Piezoelectric Nanogenerator

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