1998
DOI: 10.1016/s0960-1481(98)00141-4
|View full text |Cite
|
Sign up to set email alerts
|

The status of crystalline Si modules

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
4

Citation Types

0
4
0

Year Published

2009
2009
2012
2012

Publication Types

Select...
2
2

Relationship

0
4

Authors

Journals

citations
Cited by 4 publications
(4 citation statements)
references
References 0 publications
0
4
0
Order By: Relevance
“…In 2011, more than 85% of the solar cell industries were based on the single crystal and mc-Si [1]. Since 60% of the solar cell cost is due to the wafer material and mc-Si has 30-50% lower cost compared to mono crystalline (mono c-Si), mc-Si is getting a significant attention for the future solar energy market [2] [3]. Compared to mono c-Si, the low electrical performance of mc-Si is the main drawback, which increases the cell processing cost.…”
Section: Introductionmentioning
confidence: 99%
“…In 2011, more than 85% of the solar cell industries were based on the single crystal and mc-Si [1]. Since 60% of the solar cell cost is due to the wafer material and mc-Si has 30-50% lower cost compared to mono crystalline (mono c-Si), mc-Si is getting a significant attention for the future solar energy market [2] [3]. Compared to mono c-Si, the low electrical performance of mc-Si is the main drawback, which increases the cell processing cost.…”
Section: Introductionmentioning
confidence: 99%
“…price of the silicon wafer [1,2]. In this respect, the high quality poly-Si thin film is an attractive alternative due to its relatively cheap fabrication cost [3].…”
Section: Introductionmentioning
confidence: 99%
“…Although screen-printing technology has many limitations, including an inability to form fine lines, achieve good metal conductivity and low contact resistance, it is generally used to fabricate cells for reduced production costs and fast processes for mass production. 1) Previous researches showed that the glass frit plays the most important role during contact formation: etching through the antireflection coating and accomplish good ohmic contact and a transport medium for the silver crystals to grow into the h111i planes of the inverted pyramids and then the formation of Ag-Si contacts below the silversilicon eutectic temperatures. 2) Various experiments with Ag pastes were carried out to examine the silver transport and growth process in detail.…”
Section: Introductionmentioning
confidence: 99%
“…2) Various experiments with Ag pastes were carried out to examine the silver transport and growth process in detail. 1,2) At temperatures typically above 600 C, the glass frits become fluid, wet the SiN x , and begin to etch the SiN x layer. 3) After that process, the melted glass is etched into silicon through a redox reaction between the lead oxide and silicon.…”
Section: Introductionmentioning
confidence: 99%