2006
DOI: 10.1016/j.surfcoat.2005.11.051
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The structure and hardness of magnetron sputtered Ti–Al–N thin films with low N contents (<42 at.%)

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Cited by 24 publications
(10 citation statements)
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“…The TiAlN coating hardness increased with an increasing nitrogen flow rate due to the presence of the AlN phase along with the TiN phase [5]; however, a further increase in the nitrogen flow rate increases the presence of the AlN phase, and it is not useful for the wear resistance application. The TiAlN coating hardness increased with an increasing nitrogen flow rate due to the increase of the nitrogen content [12]. The nitrogen content influenced the amorphous and crystalline phase formation and affected the coating hardness.…”
Section: Resultsmentioning
confidence: 99%
“…The TiAlN coating hardness increased with an increasing nitrogen flow rate due to the presence of the AlN phase along with the TiN phase [5]; however, a further increase in the nitrogen flow rate increases the presence of the AlN phase, and it is not useful for the wear resistance application. The TiAlN coating hardness increased with an increasing nitrogen flow rate due to the increase of the nitrogen content [12]. The nitrogen content influenced the amorphous and crystalline phase formation and affected the coating hardness.…”
Section: Resultsmentioning
confidence: 99%
“…Therefore, the TiAlN coating hardness increases with an increase of Al content. The hardness of the TiAlN coating should increase with an increasing negative substrate bias due to the increasing Al content; however, there is an optimum Al content that can enhance the TiAlN hardness [12]. The hardness increases with an increasing Al concentration and reaches a maximum value at an Al concentration of 50 mol% [13].…”
Section: Resultsmentioning
confidence: 99%
“…This is presumably because of the slower deposition rate due to the lower Cr target current used to deposit CrSiN-3 (see Table 1). In addition, for coating deposition in a constant nitrogen flow rate environment, as is the case in this study, a smaller Cr target current is more vulnerable to the so-called target "poisoning effect" [24], which refers to the formation of a compound film on the target surface that leads to a significant reduction in the deposition rate [25].…”
Section: Page 8 Of 30mentioning
confidence: 93%