The study of the curing mechanism, kinetic and mechanical performance of polyurethane/epoxy composites using aliphatic and aromatic amines as curing agents

Bratasyuk, Nikita A.; Zuev, V. V.

doi:10.1016/j.tca.2020.178598

Cited by 21 publications

(10 citation statements)

References 21 publications

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“…Epoxy‐polyurethane resins with different compositions (mass fraction of PU and mass fraction and length of PEG fragments) were prepared as described previously. [ 18 ] The compositions of samples under study are given in Table 1.…”

Section: Experimental Partmentioning

confidence: 99%

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The effect molecular weight of polyol components on shape memory effect of epoxy‐polyurethane composites

Bratasyuk

Zuev

2021

Polymer Engineering & Sci

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This paper describes the experimental findings of the study of a series of PU/epoxy composites, which formed interpenetrating networks and have shape‐memory properties. The morphological variation for different chemical compositions and the influences of morphology on mechanical performance and shape‐memory behavior are discussed. Length and mass fraction of polyethylene glycol (PEG) units are chosen as the key parameters in this study. The molecular weight of PEG was varied from 400 (as such PEG units are unable to crystallize) to 1500, 4000, and 6000, which are crystallizable. It was shown that the crystallization of PEG units is the key parameter, which determines the mechanical performance and shape‐memory behavior of PU/epoxy composites in this study. DMTA results show the linear dependence of glass transition temperature and tensile strength, elongation, and other mechanical parameters on the amount of PEG in PU/epoxy composites independently of the amount of PEG unit lengths. The maximal value of shape fixation rate was achieved for 30–40 mass percentage of PEG 4000 (4.5 × 10−2 s−1 at Tg + 20°C) or PEG 6000(4.1 × 10−2 s−1 at Tg + 20°C) in PU/epoxy composites.

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Section: Experimental Partmentioning

confidence: 99%

“…[ 17 ] The mixture of epoxy‐PU results in the formation of interpenetrating polymer networks (IPNs) consisting of two or more polymers wherein the network formed is held by permanent entanglements. [ 18 ]…”

Section: Introductionmentioning

confidence: 99%

The effect molecular weight of polyol components on shape memory effect of epoxy‐polyurethane composites

Bratasyuk

Zuev

2021

Polymer Engineering & Sci

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“…This is because, in non‐isothermal conditions, the final stages of curing occur at higher temperatures. Therefore, the final stages of curing are overpowered diffusion restriction by thermal energy, and reaction activation energy is only affected by chemical factors 67,68 . The trend of epoxy/alumina was similar to that of epoxy, but, its values of

E_{a}

were a bit more than those of epoxy, due to an increase in viscosity caused by adding alumina to epoxy.…”

Section: Resultsmentioning

confidence: 99%

Effect of a novel green modification of alumina nanoparticles on the curing kinetics and electrical insulation properties of epoxy composites

Mousavi

Estaji

Rostami

et al. 2021

Polymers for Advanced Techs

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A novel green surface modification was successfully implemented on alumina nanoparticles using chitosan (CS) to prevent nanoparticles' aggregation. To evaluate the surface changes of nanoparticles, FTIR, TGA, TEM, and SEM analyses were used. The cure kinetics of the uncured samples was analyzed by DSC. Different methods such as KAS, Friedman, Starink, and FWO were applied to measure the activation energy. The activation energy of epoxy reinforced with chitosan‐functionalized alumina (epoxy/[CS‐EPO‐alumina]) was less than that of epoxy reinforced with alumina (epoxy/alumina), which was a confirmation of the positive effect of CS on curing reaction kinetics. Using the Malek method, the Sestak‐Berggren autocatalytic equation was chosen to investigate the cure kinetics of the epoxy. It was found that the Sestak‐Berggren equation is well matched with the experimental data and the model was suitable to predict the epoxy curing reaction reliably. Moreover, the glass transition temperatures of all samples were approximately the same. The effect of surface modification of alumina on the electrical insulating behavior of epoxy was also studied. It was found that CS functionalized alumina (CS‐EPO‐alumina) increased volume resistivity of epoxy at a temperature range of 30 to 80°C more than that of alumina. Electric stability and breakdown strength of epoxy/alumina and epoxy/(CS‐EPO‐alumina) also enhanced, where epoxy/(CS‐EPO‐alumina) experienced a further increase compared to epoxy.

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“…In the FTIR spectra of FSP, the strong absorption bands at 3405 cm −1 , 1105 cm −1 and 2970–2869 cm −1 were due to the stretching vibrations of −OH groups, Si-O-Si groups and CH 2 and CH 3 groups, respectively [ 21 , 22 , 23 ]. In the FTIR spectra of FSP @PUU, new peaks of N-H (3349 cm −1 ) bonds, C = O (1678 cm −1 ) groups and C-O-C(1105 cm −1 ) groups were found, and the peak at 3405 cm −1 of -OH disappeared [ 24 ]. In addition, the free NCO groups (2270 cm −1 ) vanished, which indicated that the reaction was completed [ 25 ].…”

Section: Resultsmentioning

confidence: 99%

Preparation and Evaluation Mechanic Damping Properties of Fused Silica Powder@Polyurethane Urea/Cement Composites

et al. 2022

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In this paper, cement based on fused silica powder @ polyurethane urea (FSP@PUU) with a micro constrained damping structure was studied. Firstly, FSP@PUU core-shell particles were prepared by heterogeneous stepwise addition polymerization method and added into cement paste as damping filler to form a micro-constrained damping structure inside cement paste. The mechanical property and damping performance of cement-based composites were characterized by compressive strength, dynamic mechanical analysis (DMA) test and modal vibration test. The results showed that the damping performance of FSP @ PUU cement-based composites was affected by temperature, and the loss tangent of cement with 6wt% FSP@PUU increased to about 0.057 at −35 °C to 35 °C, which was 1.5 times cement paste within the glass transition temperature. With 6 wt% FSP@PUU, the damping ratio of cement-based composites increased by 58% compared with cement paste in the frequency range of 175–300 Hz, while the compressive strength decreased by only 5%. The cement with suitable FSP@PUU possesses excellent damping performance.

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The study of the curing mechanism, kinetic and mechanical performance of polyurethane/epoxy composites using aliphatic and aromatic amines as curing agents

Cited by 21 publications

References 21 publications

The effect molecular weight of polyol components on shape memory effect of epoxy‐polyurethane composites

The effect molecular weight of polyol components on shape memory effect of epoxy‐polyurethane composites

Effect of a novel green modification of alumina nanoparticles on the curing kinetics and electrical insulation properties of epoxy composites

Preparation and Evaluation Mechanic Damping Properties of Fused Silica Powder@Polyurethane Urea/Cement Composites

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