1987
DOI: 10.1109/t-ed.1987.22896
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The temperature dependence of the amplification factor of bipolar-junction transistors

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Cited by 24 publications
(9 citation statements)
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“…In modern CMOS processes, as the silicon impurity doping concentration becomes particularly high (>10 18 cm −3 ), the silicon bandgap narrowing (BGN) occurs [14]. For BJT, due to the BGN induced by the silicon lattice deformation in the heavily doped emitter, its forward current gain becomes strongly temperature dependent [10], which is described by (3) in the Gummel-Poon model…”
Section: A Bandgap Narrowing In Bjtmentioning
confidence: 99%
“…In modern CMOS processes, as the silicon impurity doping concentration becomes particularly high (>10 18 cm −3 ), the silicon bandgap narrowing (BGN) occurs [14]. For BJT, due to the BGN induced by the silicon lattice deformation in the heavily doped emitter, its forward current gain becomes strongly temperature dependent [10], which is described by (3) in the Gummel-Poon model…”
Section: A Bandgap Narrowing In Bjtmentioning
confidence: 99%
“…The temperature dependency of b is an exponential function of temperature, which can be expressed as [8]:…”
Section: A New Curvature Compensation Technique For a New Structurementioning
confidence: 99%
“…It can be expressed as [8]: the technique in [7]. Fig.3 shows the characteristic of the (1) variable with some values of AEG that we need in my design.…”
Section: A New Curvature Compensation Techniquementioning
confidence: 99%
“…In [7], AEG is about 63.9mev. In [8], the vertical n-p-n transistor can be approximated by (1) with A EG=24mev. The temperature-dependence characteristic of the proposed variable T/ =(T/ 1 c) X exp(AEG /(KT)) with different AEG, when the temperature is changed from 233k to 393k, is shown in Fig.2.…”
Section: The Circuit Implementation Of the Proposed Techniquementioning
confidence: 99%