The thermal conductivity of porous copper

Walter, A.J.; Trowell, A. R.

doi:10.1007/bf00549959

J Mater Sci

1971

DOI: 10.1007/bf00549959

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The thermal conductivity of porous copper

A.J. Walter

A. R. Trowell

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Cited by 3 publications

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“…The experimentally observed value is lower than the theoretically predicted value of about 320 W/mK, but it is higher than that of a sintered copper powder compact with a porosity of about 40% [17]. This can be caused by a very low effective conductivity of the SiC particles due to a low interface thermal conductance or by some silicon dissolved into copper.…”

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confidence: 57%

Interfacial design of Cu/SiC composites prepared by powder metallurgy for heat sink applications

Schubert¹,

Brendel

Schmid

et al. 2007

Composites Part A: Applied Science and Manufacturing

123

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In order to dissipate the heat generated in electronic packages, suitable materials must be developed as heat spreaders or heat sinks. Metal matrix composites (MMCs) offer the possibility to tailor the properties of a metal (Cu) by adding an appropriate reinforcement phase (SiC) to meet the demands for high thermal conductivities in thermal management applications.Copper/SiC composites have been produced by powder metallurgy. Silicon carbide is not stable in copper at the temperature needed for the fabrication of Cu/SiC. The major challenge in development of Cu/SiC is the suppression of this reaction between copper and SiC.Improvements in bonding strength and thermo-physical properties of the composites have been achieved by a vapour deposited molybdenum coating on SiC powders to control the detrimental interfacial reactions.

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contrasting

confidence: 57%

Interfacial design of Cu/SiC composites prepared by powder metallurgy for heat sink applications

Schubert¹,

Brendel

Schmid

et al. 2007

Composites Part A: Applied Science and Manufacturing

123

View full text Add to dashboard Cite

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Thermal Mode Spectroscopy for Thermal Diffusivity of Millimeter-Size Solids

et al. 2016

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Heat conduction possesses (thermal) modes in analogy with acoustics even without oscillation. Here, we establish thermal mode spectroscopy to measure the thermal diffusivity of small specimens. Local heating with a light pulse excites such modes that show antinodes at the heating point, and photothermal detection at another antinode spot allows measuring relaxation behavior of the desired mode selectively: The relaxation time yields thermal diffusivity. The Ritz method is proposed for arbitrary geometry specimens. This method is applicable even to a diamond crystal with ∼1 mm dimensions.

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Fabrication of High Aspect Ratio Porous Microfeatures Using Hot Compaction Technique

Chen

Kim

2008

Journal of Manufacturing Science and Engineering

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High aspect ratio porous microfeatures are becoming more important in the modern industry. However, the fabrication of such features under a mass production environment remains a challenge when robustness, cost effectiveness, and high productivity requirements are required. In this study, the forming of such porous microfeatures using hot compaction was investigated. A hot compaction experimental setup was designed and fabricated that is capable of performing high temperature operation (700°C), quick heatup, and avoiding oxidation. 3D thermal simulation of the experimental setup was conducted to investigate the heat transfer performance and internal temperature distribution, which was then used as a reference for the experiment. Hot compaction experiments were carried out, and the effects of compression force and temperature on the quality in terms of powder consolidation strength and porosity were investigated. In addition, the achievable aspect ratio and taper angle were also discussed.

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The thermal conductivity of porous copper

Cited by 3 publications

References 8 publications

Interfacial design of Cu/SiC composites prepared by powder metallurgy for heat sink applications

Interfacial design of Cu/SiC composites prepared by powder metallurgy for heat sink applications

Thermal Mode Spectroscopy for Thermal Diffusivity of Millimeter-Size Solids

Fabrication of High Aspect Ratio Porous Microfeatures Using Hot Compaction Technique

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