The use of IR spectroscopy to study the reaction of motor-oil additives

Vipper, A. B.; Bauman, V. N.; Egorova, K. A.; Shimonaev, G. S.

doi:10.1007/bf00716531

Cited by 1 publication

(1 citation statement)

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“…In Figure c, five upward characteristic peaks (C, D, E, F, and G) belonging to the [Cu 2 (Cit) 2 ] 2– ion still exist, whereas their peak intensities weakened, indicating that SM inhibits the electroreduction of the [Cu 2 (Cit) 2 ] 2– ion, which is in accord with the results of LSV curves in Figure . There are also three upward characteristic peaks (H, I, and J) arising at about 1774 cm –2 for ν (CO), 1713 cm –2 for ν(CO), and 1202 cm –2 for ν (C–N) of SM, , and their peak intensities slightly increased due to its consumption with the potential negatively shifting. The consumption may result from the electroreduction of SM to the SM anion …”

Section: Resultsmentioning

confidence: 99%

Novel, Simple, and Green Citrate-Based Copper Electronic Electroplating Bath in Microvia Void-Free Filling for Printed Circuit Board Application

Jin

Wang

et al. 2022

ACS Sustainable Chem. Eng.

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In this work, a novel, simple, and green citrate-based copper electronic electroplating bath with the characteristics of weak corrosion, low copper ion concentration, and simple composition is developed in microvia void-free filling for printed circuit board application. Succinimide (SM), regarded as a leveler, is the core component of the bath. The action mechanisms of SM on microvia void-free copper filling are carefully expounded. UV–vis spectroscopy and theoretical calculations demonstrate that only the [Cu2(Cit)2]2– coordination ion exists in the bath containing SM at pH 9.0. Linear sweep voltammetry and in situ Fourier transform infrared spectroscopy combined with X-ray photoelectron spectroscopy experiments illustrate that SM can inhibit the electroreduction of the [Cu2(Cit)2]2– coordination ion and promote the electroreduction of intermediate Cu(I) to Cu(0), resulting in the improvement of coating quality. Galvanostatic measurements reveal that the reduction of the [Cu2(Cit)2]2– coordination ion is electrochemically controlled, and SM is diffusion-controlled. The leveler properties of SM (diffusion control and inhibition of [Cu2(Cit)2]2– coordination ion electroreduction) promote copper in bottom-up growing and void-free filling of microvias.

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Section: Resultsmentioning

confidence: 99%