The use of metal-matrix Al-SiC composites in heat-spreading bases of power electronic devices

The Uniformal Metallization of the AlSiC Metal Matrix Composite Material Surface

“…Methods of dielectrics and semiconductor chemical metallization are known [8]- [10], but these methods require additional ways of treatment, such as sensibilization and activation that complicate the process and cannot be applied to aluminium. The method of aluminium sublayer preliminary coating on the AlSiC surface followed by electrochemical nickel deposition has previously been used [11]. In the research center VIAM has been elaborated technological scheme for chemical nickellization, which allows to exclude intermediate step of coating of the AlSiC surface of aluminium sublayer and to obtain the uniformal AlSiC surface metallization of high adhesive on aluminium and silicon carbide areas.…”

Studying the microstructure of AlSiC metal matrix composite material by scanning electron microscopy

“…An efficient solution to this problem is using bases made of a metal matrix composite material (MMCM) based on aluminum matrix alloy reinforced by a filler, i.e., particles of silicon carbide [1][2][3][4][5] with high (>65%) concentrations of SiC. In addition to low cost source materials, such materials have low density along with adjustable (by changing the ratios of com ponents) TEC, thermal conductivity, strength, and hardness.…”