The wetting characteristics of molten Ag–Cu–Au on Cu substrates: a molecular dynamics study

Abstract

Ag-Cu-Au ternary alloys are promising solder materials for wire bonding. Scarce experimentation on Ag-Cu-Au materials can be found due to the high cost of gold. In this study, face-centered-cubic Cu(100),...

New insights into hydrophobicity at nanostructured surfaces: Experiments and computational models

“…According to their results, with the increasing depth of the surface cavities, the water droplet varied from hydrophilic (73°) to hydrophobic (> 90°) and existed in various states, including the CB, WZ, and intermediate states, in which the cavities were partially filled with liquid. This was also in accordance with the experiment by Abdelsalam et al 113 On the other hand, Yang et al 114 studied wetting characteristics of a molten Ag-Cu-Au alloy on Cu substrates since Ag-Cu-Au is a promising alloy bonding wire for semiconductors. According to their results of MD wettability measurements of binary Ag-Cu and ternary Ag-Cu-Au droplet models on Cu(100), Cu (111), and Cu (110) substrates, ternary Ag-Cu-Au alloy with contact angle at equilibrium 25.2°with the largest tendency of solder spreading and greatest variation of dissolution degree has a higher solubility than that of binary Ag-Cu with contact angle 19.7°.…”

Atomistic simulations of Ag–Cu–Sn alloys based on a new modified embedded-atom method interatomic potential

“…An initial population of candidate solutions were randomly generated and evolved toward better solutions for further iterations. The population size (36) was greater than the required 2NN MEAM potential parameters for pure (14), binary (13), and ternary (6) systems. The optimization started by specifying a radial cutoff distance, reference structures for target unary and binary systems, and fitting weights of each atomic configuration.…”

“…For example, the possible melting point depression of nano-sized solder alloys is of interest [11] because the melting point of the usual bulk SAC alloys is ~ 34 K higher than that of the bulk Sn-Pb-based solder alloys [4]. The wettability of small-sized solders on copper substrates is also of particular interest because the synthesis of small-sized solder particles with a binary or ternary alloy of uniform composition is much more difficult than that of monolithic particles and larger solder balls [12,13].…”

1000 °C High-Temperature Wetting Behaviors of Molten Metals on Laser-Microstructured Metal Surfaces

“…Recently, molten metals have also been proposed to be potential novel materials in various fields, such as newly developed batteries and nuclear fusion. − The wetting of molten metals on various substrate surfaces has a great impact on related processes and applications, significantly affecting the processing feasibility and product performance. However, only few literature studies focused on the wettability of molten metals at high temperatures (e.g., 1000 °C) compared with the wettability studies on more common liquids under more gentle conditions, such as water and low-melting-point liquid metals at room temperature. − Various simulations have been performed to predict the probable wetting behaviors of molten metals on various substrates, − but practical observations remain scarce due to the availability of materials and the strict environmental requirements. Among the restricted experimental work, researchers prefer to improve the wettability of molten metals with several kinds of solid surfaces for better performance in welding, brazing, metal-based composite formation, and lithium battery preparation. − ,− For example, Wu et al proposed a method to enhance the wettability of a kind of room-temperature gallium-based liquid metal on polyacrylate surfaces for a better connection, Fan et al modified the wetting and spreading behaviors of Sn on the SiC surface by changing the content of the alloying element Cr, Li et al enhanced the wettability of molten high manganese steel with Ni–Co-coated ZTA ceramic particles to strengthen the abrasive wear resistance of the composites, and Sui et al studied the wetting ability of molten Ce and Cu–Ce alloy on various carbon materials.…”

“…On the other hand, limited publications studied the effect of surface microstructures on the wetting behaviors of molten metals on substrates at high temperatures, while most of them concerned about the composition of the melts and the substrate surfaces or the periphery conditions. − ,,− , Lai et al found that a microporous copper substrate enhanced the wetting of molten Sn, while Zhou et al structured the steel mold surfaces to weaken the adhesion of the molten and resolidified Al alloys with the mold by preventing their full wetting. Liu et al discussed the effect of laser-textured stainless steel surface structures on the wetting and spreading behaviors of the Al–Si alloy in the presence of flux, and Lin et al observed that rough silica surfaces improved the spreading of the Sn–Ag–Ti alloy.…”