Theoretical and experimental investigation of chemical mechanical polishing of W–Ni–Fe alloy

Guo, Jun; Shi, Xu; Song, Chuanping; Niu, Lin; Cui, Haiyang; Guo, Xiaoguang; Tong, Zhen; Yu, Nan; Jin, Zhuji; Kang, Renke

doi:10.1088/2631-7990/abefb8

Cited by 31 publications

(9 citation statements)

References 35 publications

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“…CMP is a technique for atomic-level removal. The chemical reaction of the polishing slurry and the mechanical interaction of the abrasive are combined to remove material [ 56 , 57 ]. The workpiece is fixed on the polishing workhead spindle and loaded downward against the polishing pad.…”

Section: Chemical Modification Polishing Approachesmentioning

confidence: 99%

Polishing Approaches at Atomic and Close-to-Atomic Scale

2023

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Roughness down to atomic and close-to-atomic scale is receiving an increasing attention in recent studies of manufacturing development, which can be realized by high-precision polishing processes. This review presents polishing approaches at atomic and close-to-atomic scale on planar and curved surfaces, including chemical mechanical polishing, plasma-assisted polishing, catalyst-referred etching, bonnet polishing, elastic emission machining, ion beam figuring, magnetorheological finishing, and fluid jet polishing. These polishing approaches are discussed in detail in terms of removal mechanisms, polishing systems, and industrial applications. The authors also offer perspectives for future studies to address existing and potential challenges and promote technological progress.

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Section: Chemical Modification Polishing Approachesmentioning

confidence: 99%

Polishing Approaches at Atomic and Close-to-Atomic Scale

2023

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“…Subsequently, the similar calculation process will be performed until reaching the output layer after the next neuron received the values. Finally, the cost function is determined in equation (6).…”

Section: Hidden Layers and Nodesmentioning

confidence: 99%

“…At present, as a frequently used method to obtain high quality surfaces, CMP process combining chemical corrosion and abrasive mechanical removal has been widely applied to manufacture semi-conductor, micro-sensor and optical components. 6,7…”

Section: Introductionmentioning

confidence: 99%

Modelling and optimization of surface roughness in chemical mechanical polishing based on DNN-GA

Pan

Guo

et al. 2023

Proceedings of the Institution of Mechanical Engineers, Part C:

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The surface quality of Lithium Niobate (LiNbO3) has a significant influence on photonics and optoelectronics components. However, the prediction and optimization models of surface roughness were not accurate due to the random parameters. Hence, a prediction model of surface roughness is established based on an improved neural network, and a new method is proposed to optimize the arguments in chemical mechanical polishing (CMP) process. In the model, the structure of the neural network is optimized according to data features rather than choosing networks randomly. To improve the model accuracy, the optimal number of hidden layers is 4 and the corresponding amounts of nodes in each layer are 46, 34, 28, and 33, respectively. ReLU function is chosen as activation function. Subsequently, the relationship between surface roughness and processing parameters is built and the variation process of surface roughness is particularly considered. The accuracy and generalization ability of the model is verified by the experiments with the Mean Absolute Percentage Error (MAPE) of 6.42% and Root Mean Square Error (RMSE) of 0.403. Furthermore, the Genetic Algorithm (GA) method based on the selected model is applied to optimize processing arguments under the target surface roughness value of 0.3 nm. The accuracy of the fusion model is also validated by experiments with an error of 13.3%.

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“…The surface quality of tungsten film will affect the interconnect performance of devices, and therefore the surface of tungsten film needs to be polished [ 8 ]. Ultra-precision polishing is the final processing method to reduce the surface roughness of workpiece, remove the damaged layer, and obtain high surface accuracy and excellent surface quality [ 9 , 10 , 11 ]. However, as a typical hard and brittle material, there are great challenges in the ultra-precision polishing of tungsten due to the high hardness, high brittleness, and great wear resistance of material [ 12 , 13 ].…”

Section: Introductionmentioning

confidence: 99%

Effects of pH Values and H2O2 Concentrations on the Chemical Enhanced Shear Dilatancy Polishing of Tungsten

Wang

Chen

et al. 2022

Micromachines

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In order to obtain tungsten with great surface qualities and high polishing efficiency, a novel method of chemical enhanced shear dilatancy polishing (C-SDP) was proposed. The effects of pH values and H2O2 concentrations on the polishing performance of tungsten C-SDP were studied. In addition, the corrosion behaviors of tungsten in solutions with different pH values and H2O2 concentrations were analyzed by electrochemical experiments, and the valence states of elements on the tungsten surface were analyzed by XPS. The results showed that both pH values and H2O2 concentrations had significant effects on tungsten C-SDP. With the pH values increasing from 7 to 12, the MRR increased from 6.69 µm/h to 13.67 µm/h. The optimal surface quality was obtained at pH = 9, the surface roughness (Ra) reached 2.35 nm, and the corresponding MRR was 9.71 µm/h. The MRR increased from 9.71 µm/h to 34.95 µm/h with the H2O2 concentrations increasing from 0 to 2 vol.%. When the concentration of H2O2 was 1 vol.%, the Ra of tungsten reached the lowest value, which was 1.87 nm, and the MRR was 26.46 µm/h. This reveals that C-SDP technology is a novel ultra-precision machining method that can achieve great surface qualities and polishing efficiency of tungsten.

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Theoretical and experimental investigation of chemical mechanical polishing of W–Ni–Fe alloy

Cited by 31 publications

References 35 publications

Polishing Approaches at Atomic and Close-to-Atomic Scale

Polishing Approaches at Atomic and Close-to-Atomic Scale

Modelling and optimization of surface roughness in chemical mechanical polishing based on DNN-GA

Effects of pH Values and H2O2 Concentrations on the Chemical Enhanced Shear Dilatancy Polishing of Tungsten

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