The modified thermal device model was 1 adapted to determine the channel temperature of the 2 AlGaN/GaN HEMT operating under pulsed and quasi-static 3 conditions. The differential analysis of the isothermal and 4 thermal part of the resulting current, as well as ambient 5 temperature variation, is utilized to determine the average 6 channel temperature. Ambient temperature increases in 7 the device operating range is required under low-power 8 operation only, while under high-power operation the ther-9 mal stress of the device is significantly reduced due to 10 small ambient temperature variation. In addition, trapping 11 phenomena incorporation is demonstrated to obtain more 12 accurate results utilizing the HEMT threshold voltage shift 13 and transconductance. For experimental verification of the 14 thermal model, Al 0.25 Ga 0.75 N/GaN HEMT electrical proper-15 ties are investigated. Experimentally verified results are in 16 a good agreement with numerical simulations. 17 Index Terms-AlGaN, average channel temperature, 18 charge trapping, FET, GaN, HEMT. 19 I. INTRODUCTION 20 T HE high mobility combined with a high carrier density in 21 two-dimensional electron gas (2DEG) in gallium nitride 22 (GaN)-based wide bandgap structure gives an opportunity 23 to fabricate the advanced electrical devices like high elec-24 tron mobility transistors (HEMTs) exhibiting superior prop-25 erties in the field of high-power, temperature, frequency, and 26 microwave applications [1], [2], [3]. However, high operating 27 voltage resulting in a high local electric field and dissipated 28 power density bringing device self-heating have an impact 29 on the device reliability although those negative phenomena 30 Manuscript