2020
DOI: 10.1080/14658011.2020.1732124
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Theoretical modelling of kinetics of glass transition temperature of PEG toughened epoxy

Abstract: In this paper, we examined glass transition, a very important parameter that determines the properties and applications of epoxy resins by the innovative approach of kinetic study. The effect of thermoplastic filler Polyethylene Glycol-1000 (PEG-1000) on the kinetics of glass transition temperature of epoxy was analysed by varying the filler loadings and the heating rates. The differential scanning calorimetry curves were plotted at heating rates of 5, 10, 15 and 20°C, respectively and the kinetics of glass tr… Show more

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Cited by 19 publications
(12 citation statements)
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“…Generally, the more flexible the molecular chain, the lower the glass transition temperature. T g of the six cured samples ranged from 11.28°C to 46.25°C, which was much lower than 120°C of pure epoxy resin 30 and much larger than −125°C of pure silicone 31 . This indicated that the molecular chain flexibility of SEP was much better than that of pure epoxy resin, and the intermolecular force and mechanical strength of SEP were higher than that of pure silicone resin.…”
Section: Resultsmentioning
confidence: 90%
See 1 more Smart Citation
“…Generally, the more flexible the molecular chain, the lower the glass transition temperature. T g of the six cured samples ranged from 11.28°C to 46.25°C, which was much lower than 120°C of pure epoxy resin 30 and much larger than −125°C of pure silicone 31 . This indicated that the molecular chain flexibility of SEP was much better than that of pure epoxy resin, and the intermolecular force and mechanical strength of SEP were higher than that of pure silicone resin.…”
Section: Resultsmentioning
confidence: 90%
“…The temperature of 50% mass loss. much lower than 120 C of pure epoxy resin 30 and much larger than À125 C of pure silicone. 31 This indicated that the molecular chain flexibility of SEP was much better than that of pure epoxy resin, and the intermolecular force and mechanical strength of SEP were higher than that of pure silicone resin.…”
Section: Thermal Mechanical Properties Of Cured Silicone-epoxy Copolymermentioning
confidence: 86%
“…The PEG has been reinforced with nanofillers to form nanocomposites [60]. The glass transition temperature of PEG has been found to alter with the addition of additives and nanofillers [61]. In addition, additives and nanofillers have been used to enhance the mechanical properties of the PEG-based nanocomposites [62].…”
Section: Polyhydroxyalkanoatementioning
confidence: 99%
“…The stress concentrator is produced by the rubber dispersed phase, which induces the silver streak and shear deformation; [5,6] Thermoplastic materials, which have good toughness and high modulus and heat resistance, are used to modify EP to ensure its modulus and thermal stability. [7][8][9][10][11] The hyperbranched polymers refer to chemically induced phase separation and particle cavitation, which induce the stress concentration and shear deformation of EP to absorb more external energies. [12,13] Block copolymer, which has excellent compatibility with the resin group, can form a microphase nanostructure in the matrix resin self-assembly and achieve a toughening effect during the curing phase separation.…”
Section: Introductionmentioning
confidence: 99%