“…In atmospheric plasma etching, Dai et al ( 3 ) dealt with the nonlinear dependence of material removal rate on dwell time by considering a nested pulsed iterative method to evaluate and correct the time-varying nonlinearity of the process and enable the machining of pocket geometries in fused silica. In optical surfacing, Beaucamp and coworkers ( 4 ) showed how variable pitch path self-planning strategies, underpinned by a simple, linear model for material removal, can be used to improve the uniformity of a polished surface. In ion beam machining, an approximate solution of the inverse problem involves varying the dwell time of the beam on each pixel of the required surface ( 5 ).…”