Theoretical Study on Synchronous Characterization of Surface and Interfacial Mechanical Properties of Thin-Film/Substrate Systems with Residual Stress Based on Pressure Blister Test Technique

Abstract

Abstract:In this study, based on the pressure blister test technique, a theoretical study on the synchronous characterization of surface and interfacial mechanical properties of thin-film/substrate systems with residual stress was presented, where the problem of axisymmetric deformation of a blistering film with initial stress was analytically solved and its closed-form solution was presented. The expressions to determine Poisson's ratios, Young's modulus, and residual stress of surface thin films were derived; the work done by the applied external load and the elastic energy stored in the blistering thin film were analyzed in detail and their expressions were derived; and the interfacial adhesion energy released per unit delamination area of thin-film/substrate (i.e., energy release rate) was finally presented. The synchronous characterization technique presented here has theoretically made a big step forward, due to the consideration for the residual stress in surface thin films.

A Refined Theory for Characterizing Adhesion of Elastic Coatings on Rigid Substrates Based on Pressurized Blister Test Methods: Closed-Form Solution and Energy Release Rate

“…By giving up the so-called small-rotation-angle assumption (i.e., the assumption (i)), Sun et al re-solved the well-known Hencky problem and obtained its power series solution [23], and solved the problem of axisymmetric deformation of prestressed Föppl-Hencky membrane under constrained deflecting [24]. Yang et al [15] obtained the closed-form solution of the axisymmetric deformation problem of prestressed membrane also by giving up the so-called small-rotation-angle assumption. Recently, Sun et al [25] presented a new closed-form solution of the well-known Hencky problem by simultaneously giving up the assumptions (i) and (ii), but the assumption (iii) is still where it is.…”

“…delamination between thin elastic coating films and rigid substrates. However, compared with the peeling method, the blister test technique has the advantages of axisymmetric blister geometry and small angle at the crack front [15]. Dannenberg initially proposed using the blister test technique to characterize the interface adhesion strength [15].…”

“…However, compared with the peeling method, the blister test technique has the advantages of axisymmetric blister geometry and small angle at the crack front [15]. Dannenberg initially proposed using the blister test technique to characterize the interface adhesion strength [15]. In a blister test, a hole is bored or chemically etched in the rigid substrate until it reaches the thin film, and then a crack driving force is applied gradually through the hole until an axisymmetric blister crack extends into the interface of the thin film/substrate system.…”

“…Blister tests and peeling tests are two methods often used for the delamination between thin elastic coating films and rigid substrates. However, compared with the peeling method, the blister test technique has the advantages of axisymmetric blister geometry and small angle at the crack front [ 15 ].…”

A Theoretical Study on an Elastic Polymer Thin Film-Based Capacitive Wind-Pressure Sensor

“…The problem before the peripherally fixed wind-driven circular polymer elastic thin film touches the spring-driven movable electrode plate is simplified into the well-known Föppl–Hencky membrane problem, i.e., the problem of axisymmetric deformation of a peripherally fixed circular membrane under the action of uniformly distributed transverse loads q [ 34 , 35 , 36 , 37 , 38 , 39 , 40 ], as shown in Figure 2 a. The effectiveness of the well-known Hencky solution is recognized.…”