2014
DOI: 10.1007/s10559-014-9618-4
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Theory of Reliable and Secure Data Transmission in Sensory and Local Area Networks

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Cited by 17 publications
(6 citation statements)
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“…iii) standard data exchange protocols (DEPs) are used in computer networks (CN) such as Ethernet, Token Ring, FDDI, PPP, Frame Relay, HDLC [17].…”
Section: Effective Coding Of Measurement Information and Improvement Of Data Exchange Protocolsmentioning
confidence: 99%
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“…iii) standard data exchange protocols (DEPs) are used in computer networks (CN) such as Ethernet, Token Ring, FDDI, PPP, Frame Relay, HDLC [17].…”
Section: Effective Coding Of Measurement Information and Improvement Of Data Exchange Protocolsmentioning
confidence: 99%
“…Here, the following denotations are used: PA (Preamble), SD (Start Delimiter), FC (Frame Control), DA (Destination Address), AC (Access Control), SA (Source Address), PDU (Packet Data Unit), FCS (Frame Check Sequence), CRC (Cyclic Redundancy Check), ED/FS (End Delimiter/Frame Status), FT (Frame Type), and F (Flag). The feature of the frame of the most common HDLC protocol [17] is the possibility of a code combination of the flag (01111110) in the middle of its structure, which leads to crashes and incorrect frame synchronization. The use of the bit-staging operation, which implements an insert "0" after every five odd bits in the structure of the frame, solves this problem by removing such inserts by the processor on the receiving side of the communication channel.…”
Section: Effective Coding Of Measurement Information and Improvement Of Data Exchange Protocolsmentioning
confidence: 99%
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“…The Junction temperature is the temperature at which electronic devices become dead. Junction temperature tells about the life of a device [11], [12]. In order to drive electronic device in safe mode, junction temperature should be less than 125ᵒC.…”
Section: A Temperatures Of Electronic Devicesmentioning
confidence: 99%
“…With a heat sink, heat from a device flows from the junction to the case, then from the case to the heat sink, and lastly from the heat sink to ambient air [15]. The goal is to reduce thermal resistance [16], [17].…”
Section: A Heat Sink Profilementioning
confidence: 99%