Thermal Ageing Studies of Sintered Micron-Silver (Ag) Joint as a Lead-Free Bonding Material

Siow, Kim Shyong; Chua, S. T.

doi:10.1007/s12540-019-00394-0

Cited by 12 publications

(3 citation statements)

References 29 publications

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“…During the sintering, in order to avoid electron beam radiation, only open the gun valve when sampling the sample [ 23 ]. We referred to the micron silver sintering profile by K. S. Siow [ 24 ], and we set the sintering temperature to 250 °C for 10 min on the pressureless setting.…”

Section: Methodsmentioning

confidence: 99%

Molecular Dynamics Simulation of Sintering Densification of Multi-Scale Silver Layer

et al. 2022

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Based on molecular dynamics (MD), in this study, a model was established to simulate the initial coating morphology of silver paste by using a random algorithm, and the effects of different sizes of particles on sintering porosity were also analyzed. The MD result reveals that compared with the sintering process using large-scale silver particles, the sintering process using multi-scale silver particles would enhance the densification under the same sintering conditions, which authenticates the feasibility of adding small silver particles to large-scale silver particles in theory. In addition, to further verify the feasibility of the multi-scale sintering, a semi in-situ observation was prepared for a sintering experiment using micro-nano multi-scale silver paste. The feasibility of multi-scale silver sintering is proved by theoretical and experimental means, which can provide a meaningful reference for optimizing the sintering process and the preparation of silver paste for die-attach in powering electronics industry. In addition, it is hoped that better progress can be made on this basis in the future.

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Section: Methodsmentioning

confidence: 99%

Molecular Dynamics Simulation of Sintering Densification of Multi-Scale Silver Layer

et al. 2022

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“…The sintering–bonding process of Ag NP pastes has recently become a hot topic [ 51 ]. The research objective is to develop a low-temperature bonding and enhance the bondability and robustness of joints.…”

Section: Interconnections Using Ag Np Pastesmentioning

confidence: 99%

A Review of Sintering-Bonding Technology Using Ag Nanoparticles for Electronic Packaging

Yan

2021

Nanomaterials

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Metal nanoparticles (NPs) have attracted growing attention in recent years for electronic packaging applications. Ag NPs have emerged as a promising low-temperature bonding material owing to their unique characteristics. In this study, we mainly review our research progress on the interconnection of using polyol-based Ag NPs for electronic packaging. The synthesis, sintering-bonding process, bonding mechanism, and high-temperature joint properties of Ag NP pastes are investigated. The paste containing a high concentration of Ag NPs was prepared based on the polyol method and concentration. A nanoscale layer of organic components coated on the NPs prevents the coalescence of Ag NPs. The effects of organic components on the bondability of the Ag NP paste were studied. Compared to the aqueous-based Ag NP paste, the polyol-based Ag NP with the reduction of organic component can improve the bondability, and the coffee ring effect was successfully depressed due to the increased Marangoni flow. The sintering behaviors of Ag NPs during the bonding process were investigated using the classical sphere-to-sphere approach. The mechanical property of joints using this Ag paste was better than that using Pb95Sn5 solders after storage at high temperatures. The sintering–bonding technology using polyol-based Ag NPs was helpful to the low-temperature interconnection for electronic packaging applications.

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“…Paste contains organic additives so that the Ag particles do not interact with each other before the bonding process. Since the driving force of sintering becomes different with respect to the particle size, the process temperature and time are applied with various levels 18) . Moreover, the bonding time needs to be optimized depending on the sintering process that is conducted with or without a pressure 15) .…”

Section: Introductionmentioning

confidence: 99%

Strategies to Reduce Transient Liquid Phase Bonding Time for the Die Attach of Power Semiconductors

Sohn

Kim

et al. 2020

Journal of Welding and Joining

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Thermal Ageing Studies of Sintered Micron-Silver (Ag) Joint as a Lead-Free Bonding Material

Cited by 12 publications

References 29 publications

Molecular Dynamics Simulation of Sintering Densification of Multi-Scale Silver Layer

Molecular Dynamics Simulation of Sintering Densification of Multi-Scale Silver Layer

A Review of Sintering-Bonding Technology Using Ag Nanoparticles for Electronic Packaging

Strategies to Reduce Transient Liquid Phase Bonding Time for the Die Attach of Power Semiconductors

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