Thermal Aging Induced Underfill Degradation and Its Effect on Reliability of Advanced Packaging

X., F.; Zhang, X. R.; Lin, Ji

doi:10.1109/ectc32862.2020.00240

Cited by 13 publications

(3 citation statements)

References 13 publications

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“…5 Thermal aging significantly impacts the material properties of EMC packaging encapsulants, particularly affecting the rubbery modulus and the glass transition temperature (Tg). 19 For temperatures under 150°C, EMC primarily undergoes physical changes, leading to a gradual changing in its properties. However, at temperatures higher than the designed threshold, a chemical reaction occurs, dramatically increasing the cross-linking percentage.…”

Section: Thermal Aging Impactsmentioning

confidence: 99%

THz-TDS for IC packaging material changes detection under real-world conditions

Xi,

Varshney,

Khan

et al. 2024

Terahertz, RF, Millimeter, and Submillimeter-Wave Technology and Applications XVII

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Hardware security has been a significant challenge in semiconductor devices, leading to serious issues such as denial of service, data leakage etc at both transistor as well as package level. Detecting the usage state of a target semiconductor sample or generating a unique fingerprint can provide critical information about the sample, aiding in the prevention of counterfeiting to avoid hardware security risks. Terahertz Time-Domain Spectroscopy (THz-TDS) stands out as a powerful and non-destructive tool, capable of probing and analyzing the polymer materials. Its sensitivity to molecular-level changes makes THz-TDS suitable for studying the material, structural, and stress properties of IC packaging under real-world conditions. This research begins by reviewing the composition of Electronic Material Compatibility (EMC) materials and their variance under real-world conditions. Furthermore, the application of THz-TDS for polymer material characterization, which incloudes material, structural, and internal stress characterization, is also thoroughly reviewed. By combining these factors, we explore the potential and capability of using THz-TDS to detect real-world loaded samples and the feasibility of generating fingerprints for identifying counterfeit samples, including reused, recycled, or tampered ones.

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Section: Thermal Aging Impactsmentioning

confidence: 99%

THz-TDS for IC packaging material changes detection under real-world conditions

Xi,

Varshney,

Khan

et al. 2024

Terahertz, RF, Millimeter, and Submillimeter-Wave Technology and Applications XVII

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show abstract

“…Therefore, it is most relevant to characterize and report UF properties at these strain rates when exploring stresses in flip-chip package processing and thermal cycling conditions. Many studies have been performed previously confirming the significance of UF viscoelasticity as well as thermal aging on package performance [2], [3], [4], [5], [6], [7]. In this work, the focus was on evaluating the UF before and after thermal aging produced from real processing conditions and real thermal cycling qualification loads.…”

Section: A Backgroundmentioning

confidence: 99%

Influence of Thermally Aged Underfill on Flip-Chip Packages

Cox,

Abu-Hamdeh,

Borden

2024

IMAPSource Proceedings

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Underfill material plays a crucial role in flip-chip package reliability, thus it necessary to accurately understand the mechanical properties. The material itself is nonlinear and is dependent on degree of cure, temperature, strain rate and thermal aging, among others. In this work, two underfill materials were characterized for thermal expansion and viscoelastic properties over a wide temperature range. A second set of each material was thermally aged through flip-chip processing steps and 250 thermal cycles and then characterized. Temperature dependent thermal expansion and timetemperature dependent moduli curves were generated to represent each material type. These material models were then implemented into a nonlinear finite element model of a flip-chip package to evaluate package stress interaction through processing steps and thermal cycling. The influence that each underfill material had with and without thermal aging was analyzed with respect to typical package failure mechanisms.

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“…Moreover, the curing stage was studied numerically to predict the package warpage (Lin and Lee, 2020). In the post-underfill stage, the reliability of underfilled package was evaluated in terms of its structural mechanical behaviours (Sun et al, 2020;Yang et al, 2020;Che et al, 2020) and thermal aspects (Pham et al, 2020).…”

Section: Introductionmentioning

confidence: 99%

Surface energetic-based analytical filling time model for flip-chip underfill process

Abas

2021

SSMT

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Purpose This paper aims to present new analytical model for the filling times prediction in flip-chip underfill encapsulation process that is based on the surface energetic for post-bump flow. Design/methodology/approach The current model was formulated based on the modified regional segregation approach that consists of bump and post-bump regions. Both the expansion flow and the subsequent bumpless flow as integrated in the post-bump region were modelled considering the surface energy–work balance. Findings Upon validated with the past underfill experiment, the current model has the lowest root mean square deviation of 4.94 s and maximum individual deviation of 26.07%, upon compared to the six other past analytical models. Additionally, the current analytically predicted flow isolines at post-bump region are in line with the experimental observation. Furthermore, the current analytical filling times in post-bump region are in better consensus with the experimental times as compared to the previous model. Therefore, this model is regarded as an improvised version of the past filling time models. Practical implications The proposed analytical model enables the filling time determination for flip-chip underfill process at higher accuracy, while providing more precise and realistic post-bump flow visualization. This model could benefit the future underfill process enhancement and package design optimization works, to resolve the productivity issue of prolonged filling process. Originality/value The analytical underfill studies are scarce, with only seven independent analytical filling time models being developed to date. In particular, the expansion flow of detachment jump was being considered in only two previous works. Nonetheless, to the best of the authors’ knowledge, there is no analytical model that considered the surface energies during the underfill flow or based on its energy–work balance. Instead, the previous modelling on post-bump flow was based on either kinematic or geometrical that is coupled with major assumptions.

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Thermal Aging Induced Underfill Degradation and Its Effect on Reliability of Advanced Packaging

Cited by 13 publications

References 13 publications

THz-TDS for IC packaging material changes detection under real-world conditions

THz-TDS for IC packaging material changes detection under real-world conditions

Influence of Thermally Aged Underfill on Flip-Chip Packages

Surface energetic-based analytical filling time model for flip-chip underfill process

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