Thermal analysis and optimization of L-shape fin heat sink under natural convection using ANOVA and Taguchi

Abstract

Advancement in electronic systems resulted in miniaturization and high-power densities. Therefore, the rate of heat generation in circuit board increased dramatically. To overcome the problem of overheating, numerous heat sink designs are proposed including L-shape fins heat sink. The thermo-fluidic flow behavior and temperature difference are analyzed to get better understanding of heat transfer from the sink to ambient air. Governing equations for the model of conjugate heat transfer in three-dimensional environment are solved and discretized across the computational domain. Numerous experiments are carried out to validate the numerical results. The effect of fin numbers, height and heat sink size at three different input power is reported. Furthermore, ANOVA and Taguchi statistical methods are used to predict parameters that affect the heat transfer. The study revealed that fin height affects the heat transfer rate the most, and accounts for 25.3 percent increase in heat transfer rate. Optimization of the heat sink is carried out to ensure better efficiency of the proposed HS. The optimized conditions for the sink are observed to be heat sink size of 90mm, 9 number of fins and 33mm of fin height.

Numerical Analysis of the Desktop CPU's Straight Heatsink via a CFD Simulation Method to Achieve the Optimum Heatsink

“…Additionally, it was found that the average Thermal Design Power (TDP) is 95 watts for Intel i9 9900k according to the Intel data sheet [25]. Another source mentioned that Intel core i9 9900k, at 5 GHz, never really crossed the 100 watts limit [26].…”