Thermal Analysis and Simulation of Quad Flat No-Leads Packaging on Printed Circuit Board with ANSYS

Fu, Junyin; Huang, Hui; Zhang, Chi

doi:10.1109/ei259745.2023.10513275

2023 IEEE 7th Conference on Energy Internet and Energy System Integration (EI2) 2023

DOI: 10.1109/ei259745.2023.10513275

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Thermal Analysis and Simulation of Quad Flat No-Leads Packaging on Printed Circuit Board with ANSYS

Junyin Fu,

Hui Huang,

Chi Zhang

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Thermal Analysis and Simulation of Quad Flat No-Leads Packaging on Printed Circuit Board with ANSYS

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References 9 publications

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