Thermal analysis of Cu-organic composite nanoparticles and fabrication of highly conductive copper films

Li, Yujie; Huo, Yao; Li, Changguang; Xing, Shaozhen; Liu, Lei; Zou, Guisheng

doi:10.1016/j.jallcom.2015.07.248

Cited by 13 publications

(8 citation statements)

References 23 publications

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“…Recently, copper (Cu) nanomaterials have emerged as a potential material for flexible electronics due to its good electrical/thermal properties and economical merits [16,17]. Usually, such Cu nanomaterial based electrodes start with the synthesis of Cu nanomaterials that are sintered together using heat [18], laser [10], or chemicals [16] later to meet the conductivity requirement. Due to their large surface to volume ratio, oxidation of Cu nanomaterials is more difficult than bulk Cu.…”

Section: Introductionmentioning

confidence: 99%

One-step selective laser patterning of copper/graphene flexible electrodes

Peng

et al. 2019

Nanotechnology

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Flexible electrodes have attracted much attention in consumer electronic applications. In this work, laser direct writing is used to fabricate copper/graphene composite electrodes on a flexible substrate in one step. This direct writing process with a low power laser can reduce copper ions in thin films to form copper nanomaterials and spontaneously interconnect them to gain good conductivity, while the laser also induces the growth of multi-layer graphene that coats on copper to improve the oxidation resistance of electrodes. The electrical performance and chemical composition of flexible electrodes can be tuned by laser power, scanning speed, and defocus distance. A mechanism of in situ reduction and interconnection of copper nanomaterials during laser direct writing has been proposed. This method could largely reduce the oxidation issue by avoiding synthesis and sintering processes of copper nanomaterials. These as-written copper electrodes have good stability and have potential applications in flexible electronics, such as flexible heaters or antennas as demonstrated.

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Section: Introductionmentioning

confidence: 99%

One-step selective laser patterning of copper/graphene flexible electrodes

Peng

et al. 2019

Nanotechnology

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“…A detailed description of the experimental phenomena is presented in the supporting materials . It suggests that Na-PNFS and PVP can form polymer–surfactant complexes just like PVP and SDS [ 19 ], and a uniform stable colloidal dispersion was obtained as the product (d). The XRD, DLS, and TEM characterization ( Figure 3 , Figure 4 and Figure 5 ) further verify the formation of reddish-brown Cu@organic (e) and dark brown Cu@MC (f).…”

Section: Resultsmentioning

confidence: 99%

“…In the XPS spectrum of Cu 2p3/2 ( Figure 7 a), the peak could be deconvoluted into two peaks: 932.4 and 934.4 eV, which were assigned to the Cu and Cu-organic complex. For PVP and Na-PNFS, if there was no interaction with copper, the bonding energy of the O1s signal in C=O and S=O would appear at 529.7 [ 19 ] and 531.9 eV ( Figure 7 c), respectively. The O1s signal of the organic-capped copper nanoparticles can be deconvoluted into three peaks: 530.7, 531.9, and 533.3 eV ( Figure 7 b).…”

Section: Resultsmentioning

confidence: 99%

Mesosphere of Carbon-Shelled Copper Nanoparticles with High Conductivity and Thermal Stability via Direct Carbonization of Polymer Soft Templates

et al. 2022

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Copper nanoparticle (Cu NP) is a promising replacement for noble metal nanoparticles due to its high electrical conductivity and low cost. However, Cu NPs are relatively active compared to noble metals, and current ways of protecting Cu NPs from oxidation by encapsulation have severe drawbacks, such as a long reaction time and complicated processes. Here, a facial and effective method to prepare the mesosphere of carbon-shelled copper nanoparticles (Cu@MC) was demonstrated, and the resulting Cu@MC was both highly electrically conductive and thermally stable. Cu@organic (100 nm) was first synthesized by the reduction of Cu ions with poly (vinyl pyrrolidone) (PVP) and sodium poly ((naphthalene-formaldehyde) sulfonate) (Na-PNFS) as soft templates. Then, the carbon shells were obtained by in situ carbonization of the polymer soft templates. The Cu@organic and Cu@MC showed an anti-oxidation ability up to 175 and 250 °C in the air atmosphere, respectively. Furthermore, the Cu@MC exhibited excellent volume resistivity of 7.2 × 10−3 Ω·cm under 20 MPa, and showed promising application potential in electric sensors and devices.

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“…In this special structure, the Cu nanoparticles with 2.07 Å lattices belonged to (111) planes and the CuO nanoparticles with 2.33 Å lattices belonged to (111) planes. 39,40 At the same time, the lattice with a crystal plane spacing of 1.96 Å belonged to C 2 CuO 4 nanoparticles. This result indicated that the polymer chains on the surface of the polymer were broken randomly due to the injection of copper plasma, and a small part of copper oxide and carbon copper metal compounds are generated.…”

Section: Microstructure Of Coppermentioning

confidence: 91%

Achieving Good Bonding Strength of the Cu Layer on PET Films by Pretreatment of a Mixed Plasma of Carbon and Copper

Wang

et al. 2023

ACS Appl. Mater. Interfaces

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Cu layers were fabricated on PET films with and without pretreatment by a mixed plasma composed of carbon and copper using a magnetron sputtering technique for potential application as the flexible copper-clad laminate (FCCL) in 5G technology. In order to evaluate the effect of carbon plasma on the composited layer, the graphite target current was adjusted from 0.5 to 2.0 A. The microstructures and properties of Cu layers on PET films with different treatments were measured by an X-ray powder diffractometer, X-ray photoelectron spectroscope, Raman spectroscope, scanning electron microscope, transmission electron microscope, scratching test, indentation test, and four-probe detector. The results showed that the organic polymer carbon structure on the surface of PET films was changed to inorganic amorphous carbon due to the effect of the carbon plasma. At the same time, the active free radicals formed in the transition process react with metal copper ions to form organometallic compounds. Under the treatment of a mixed plasma of carbon and copper, the C/Cu mixed layer was formed on the PET film at the top of the substrate. Due to the presence of C/Cu mixed interlayers, the bonding strengths between the final Cu layers and the PET film substrates were improved, and the strongest bonding strength appeared when the graphite target current was 1.0 A. In addition, the presence of the C/Cu mixed interlayer enhanced the toughness of the Cu layer on PET film. It was proposed that the good bonding strength in combination and the enhanced toughness for the Cu layer on a PET film was due to the formation of a C/Cu mixed interlayer induced by the pretreatment of a mixed plasma of carbon and copper.

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Thermal analysis of Cu-organic composite nanoparticles and fabrication of highly conductive copper films

Cited by 13 publications

References 23 publications

One-step selective laser patterning of copper/graphene flexible electrodes

One-step selective laser patterning of copper/graphene flexible electrodes

Mesosphere of Carbon-Shelled Copper Nanoparticles with High Conductivity and Thermal Stability via Direct Carbonization of Polymer Soft Templates

Achieving Good Bonding Strength of the Cu Layer on PET Films by Pretreatment of a Mixed Plasma of Carbon and Copper

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